AD9778ABSVZ Analog Devices Inc, AD9778ABSVZ Datasheet - Page 55

• Manufacturer Part Number: AD9778ABSVZ
• Description: IC,D/A CONVERTER,DUAL,14-BIT,CMOS,TQFP,100PIN
• Manufacturer: Analog Devices Inc

Specifications of AD9778ABSVZ

• Number Of Bits: 14
• Data Interface: Parallel
• Number Of Converters: 2
• Voltage Supply Source: Analog and Digital
• Power Dissipation (max): 300mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP Exposed Pad, 100-eTQFP, 100-HTQFP, 100-VQFP
• Package: 100TQFP EP
• Resolution: 14 Bit
• Conversion Rate: 1 GSPS
• Architecture: Interpolation Filter
• Digital Interface Type: Parallel
• Number Of Outputs Per Chip: 2
• Output Type: Current
• Full Scale Error: ±2(Typ) %FSR
• Integral Nonlinearity Error: ±1.5(Typ) LSB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AD9778A-EBZ - BOARD EVALUATION AD9778A
• Settling Time: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD9776ABSVZ
AD9776ABSVZRL
AD9778ABSVZ
AD9778ABSVZRL
AD9779ABSVZ
AD9779ABSVZRL
AD9776A-EBZ
AD9778A-EBZ
AD9779A-EBZ
1
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
1
1
SEATING
PLANE
0.75
0.60
0.45
0.20
0.09
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
MAX
1.20
3.5°
7°
0°
25
100
1
26
0.50 BSC
16.00 BSC SQ
Figure 103. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
PIN 1
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HDT
(PINS DOWN)
TOP VIEW
14.00 BSC SQ
Package Description
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
Evaluation Board
Evaluation Board
Evaluation Board
0.27
0.22
0.17
Dimensions shown in millimeters
Rev. B | Page 55 of 56
0.15
0.05
50
76
75
51
(SV-100-1)
1.05
1.00
0.95
COPLANARITY
0.08
75
51
50
76
BOTTOM VIEW
CONDUCTIVE
HEAT SINK
(PINS UP)
NOM
6.50
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
AD9776A/AD9778A/AD9779A
100
26
1
25
Package Option
SV-100-1
SV-100-1
SV-100-1
SV-100-1
SV-100-1
SV-100-1