ADSP-21062LAB-160 Analog Devices Inc, ADSP-21062LAB-160 Datasheet - Page 60
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ADSP-21062LAB-160
Manufacturer Part Number
ADSP-21062LAB-160
Description
Digital Signal Processor(DSP) IC
Manufacturer
Analog Devices Inc
Series
SHARC®r
Type
Floating Pointr
Datasheet
1.ADSP-21062KSZ-133.pdf
(64 pages)
Specifications of ADSP-21062LAB-160
Rohs Status
RoHS non-compliant
Interface
Host Interface, Link Port, Serial Port
Clock Rate
40MHz
Non-volatile Memory
External
On-chip Ram
256kB
Voltage - I/o
3.30V
Voltage - Core
3.30V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
225-BGA
Lead Free Status / RoHS Status
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ADSP-21062LAB-160
Manufacturer:
AD
Quantity:
201
Company:
Part Number:
ADSP-21062LAB-160
Manufacturer:
Analog Devices Inc
Quantity:
10 000
ADSP-21060/ADSP-21060L/ADSP-21062/ADSP-21062L/ADSP-21060C/ADSP-21060LC
SURFACE-MOUNT DESIGN
Table 43
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Table 43. BGA Data for Use with Surface-Mount Design
Package
225-Ball Grid Array (PBGA)
2.05
65.90
BSC
0.50
is provided as an aide to PCB design. For industry-
3.42
3.17
2.92
121
180
120
181
SEAL RING
75.00 BSC SQ
75.50 BSC SQ
SIDE VIEW
TOP VIEW
29.50 BSC
Figure 45. 240-Lead Ceramic Quad Flat Package, Mounted with Cavity Up [CQFP]
LID
Ball Attach Type
Solder Mask Defined
61
240
60
1
INDEX 1
GOLD
PLATED
Rev. F | Page 60 of 64 | March 2008
Dimensions shown in millimeters
0.90
0.80
0.70
(QS-240-1B)
29.50
BSC
1.22 (4×)
2.60
2.55
2.50
3.60
3.55
3.50
Solder Mask Opening
0.63 mm diameter
NO GOLD
2.00 DIA
INDEX 2
NONCONDUCTIVE
CERAMIC TIE BAR
60
1
240
61
BOTTOM VIEW
70.00 BSC SQ
HEAT SLUG
Ball Pad Size
0.76 mm diameter
181
120
180
121
16.50 (8×)