ADSP-BF514KSWZ-4F4 Analog Devices Inc, ADSP-BF514KSWZ-4F4 Datasheet - Page 64

• Manufacturer Part Number: ADSP-BF514KSWZ-4F4
• Description: Low-Pwr BF Proc W/flash & Cnsmr Conctvty
• Manufacturer: Analog Devices Inc
• Series: Blackfin®r
• Type: Fixed Pointr

Specifications of ADSP-BF514KSWZ-4F4

• Interface: I²C, PPI, RSI, SPI, SPORT, UART/USART
• Clock Rate: 400MHz
• Non-volatile Memory: FLASH (4Mbit)
• On-chip Ram: 116kB
• Voltage - I/o: 1.8V, 2.5V, 3.3V
• Voltage - Core: 1.30V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 176-LQFP Exposed Pad, 176-eLQFP, 176-HLQFP
• Architecture: Modified Harvard
• Format: Fixed Point
• Clock Freq (max): 400MHz
• Device Input Clock Speed: 400MHz
• Ram Size: 48KB
• Program Memory Size: 1024KB
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 176
• Package Type: LQFP EP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F
SURFACE-MOUNT DESIGN
Table 56
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Table 56. BGA Data for Use with Surface-Mount Design
Package
168-Ball CSP_BGA
is provided as an aid to PCB design. For industry
CORNER
A1 BALL
1.50
1.40
1.30
Package Ball Attach Type
Solder Mask Defined
Figure 73. 168-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
DETAIL A
TOP VIEW
12.10
12.00 SQ
11.90
COMPLIANT TO JEDEC STANDARDS MO-275-GGAB-1.
Rev. B | Page 64 of 68 | January 2011
Dimensions shown in millimeters
REF
0.36
(BC-168-1)
BSC SQ
SEATING
10.40
0.70
REF
PLANE
0.80
REF
BSC
0.80
Package Solder Mask
Opening
0.35 mm diameter
14 13
DETAIL A
12
BALL DIAMETER
11
BOTTOM VIEW
10
9
0.50
0.45
0.40
8
7
6
5
COPLANARITY
0.20
4
3
1.12
1.06
1.00
2
1
0.34 NOM
0.29 MIN
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Package Ball Pad Size
0.48 mm diameter
A1 BALL
CORNER