ADSP-BF526KBCZ-3 Analog Devices Inc, ADSP-BF526KBCZ-3 Datasheet - Page 78

• Manufacturer Part Number: ADSP-BF526KBCZ-3
• Description: ADSP-BF526 Processor,300Mhz,Ethernet,USB
• Manufacturer: Analog Devices Inc
• Series: Blackfin®r
• Type: Fixed Pointr

Specifications of ADSP-BF526KBCZ-3

• Interface: DMA, Ethernet, I²C, PPI, SPI, SPORT, UART, USB
• Clock Rate: 300MHz
• Non-volatile Memory: ROM (32 kB)
• On-chip Ram: 132kB
• Voltage - I/o: 1.8V, 2.5V, 3.3V
• Voltage - Core: 1.30V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 289-CSPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ENVIRONMENTAL CONDITIONS
To determine the junction temperature on the application
printed circuit board use:
where:
T
T
center of package.
Ψ
P
Dissipation on Page
Values of θ
circuit board design considerations. θ
order approximation of T
D
ADSP-BF522/ADSP-BF523/ADSP-BF524/ADSP-BF525/ADSP-BF526/ADSP-BF527
J
CASE
JT
= Junction temperature (°C)
= Power dissipation — For a description, see
= From
Figure 74. Driver Type G Typical Rise and Fall Times (10%–90%) vs.
Figure 75. Driver Type G Typical Rise and Fall Times (10%–90%) vs.
= Case temperature (°C) measured by customer at top
9
8
7
6
5
4
3
2
1
0
9
8
7
6
5
4
3
2
1
0
0
0
JA
Table 65
are provided for package comparison and printed
Load Capacitance (2.5V V
Load Capacitance (3.3V V
T
50
50
J
34.
=
T
J
CASE
by the equation:
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
100
100
+
(
Ψ
JT
DDEXT
DDEXT
JA
t
RISE
×
can be used for a first
t
RISE
/V
/V
P
150
150
DDMEM
DDMEM
D
)
t
FALL
t
t
t
t
)
t
)
RISE
FALL
RISE
FALL
FALL
Total Power
= 2.5V @ 25
= 3.3V @ 25
= 2.5V @ 25
= 3.3V @ 25
Rev. B | Page 78 of 88 | May 2010
200
200
° C
° C
° C
° C
where:
T
Values of θ
circuit board design considerations when an external heat sink
is required.
Values of θ
circuit board design considerations.
In
dards JESD51-2 and JESD51-6, and the junction-to-board
measurement complies with JESD51-8. The junction-to-case
measurement complies with MIL-STD-883 (Method 1012.1).
All measurements use a 2S2P JEDEC test board.
Table 64. Thermal Characteristics for BC-208-1 Package
Table 65. Thermal Characteristics for BC-289-2 Package
Parameter
θ
θ
θ
θ
θ
Ψ
Ψ
Ψ
Parameter
θ
θ
θ
θ
θ
Ψ
Ψ
Ψ
A
JA
JMA
JMA
JB
JC
JA
JMA
JMA
JB
JC
JT
JT
JT
JT
JT
JT
Table
= Ambient temperature (°C)
65, airflow measurements comply with JEDEC stan-
JC
JB
are provided for package comparison and printed
are provided for package comparison and printed
Condition
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
Condition
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
T
J
=
T
A
+
(
θ
JA
×
P
D
)
Typical
23.20
20.20
19.20
13.05
6.92
0.18
0.27
0.32
Typical
34.5
31.1
29.8
20.3
8.8
0.24
0.44
0.53
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W