ADSP-BF527BBCZ-5A Analog Devices Inc, ADSP-BF527BBCZ-5A Datasheet - Page 86
![ADSP-BF527 Processor,533Mhz,Ethernet,USB](/photos/6/71/67135/bc-289-2_sml.jpg)
ADSP-BF527BBCZ-5A
Manufacturer Part Number
ADSP-BF527BBCZ-5A
Description
ADSP-BF527 Processor,533Mhz,Ethernet,USB
Manufacturer
Analog Devices Inc
Series
Blackfin®r
Type
Fixed Pointr
Specifications of ADSP-BF527BBCZ-5A
Interface
DMA, Ethernet, I²C, PPI, SPI, SPORT, UART, USB
Clock Rate
533MHz
Non-volatile Memory
ROM (32 kB)
On-chip Ram
132kB
Voltage - I/o
1.8V, 2.5V, 3.3V
Voltage - Core
1.15V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
208-CSPBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
ADZS-BF527-MPSKIT - BOARD EVAL MEDIA PLAYER BF527ADZS-BF527-EZLITE - BOARD EVAL ADSP-BF527
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ADSP-BF527BBCZ-5A
Manufacturer:
ADI
Quantity:
190
Company:
Part Number:
ADSP-BF527BBCZ-5A
Manufacturer:
Analog Devices Inc
Quantity:
10 000
Part Number:
ADSP-BF527BBCZ-5A
Manufacturer:
ADI/亚德诺
Quantity:
20 000
SURFACE-MOUNT DESIGN
Table 70
dard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Table 70. Surface-Mount Design Supplement
AUTOMOTIVE PRODUCTS
The ADBF525W model is available with controlled manufactur-
ing to support the quality and reliability requirements of
automotive applications. Note that these automotive models
may have specifications that differ from the commercial models
and designers should review the product Specifications section
Table 71. Automotive Products
1
2
3
Automotive Models
ADBF525WBBCZ4xx
ADBF525WBBCZ5xx
Package
289-Ball CSP_BGA
208-Ball CSP_BGA
Z = RoHS Compliant Part.
The use of xx designates silicon revision.
Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see
ADSP-BF522/ADSP-BF523/ADSP-BF524/ADSP-BF525/ADSP-BF526/ADSP-BF527
Processors on Page 29
is provided as an aid to PCB design. For industry-stan-
for junction temperature (T
1,2
CORNER
A1 BALL
Temperature
Range
–40ºC to +85ºC
–40ºC to +85ºC
* 1.75
1.61
1.46
3
Package Ball Attach Type
Solder Mask Defined
Solder Mask Defined
J
) specification which is the only temperature specification.
* COMPLIANT TO JEDEC STANDARDS MO-205-AM WITH
EXCEPTION TO PACKAGE HEIGHT AND BALL DIAMETER.
DETAIL A
TOP VIEW
Package Description
208-Ball CSP_BGA
208-Ball CSP_BGA
17.10
17.00 SQ
16.90
Figure 81. 208-Ball CSP_BGA (BC-208-2)
Rev. B | Page 86 of 88 | May 2010
SEATING
PLANE
BSC SQ
15.20
BSC
of this datasheet carefully. Only the automotive grade products
shown in
tions. Contact your local ADI account representative for specific
product ordering information and to obtain the specific Auto-
motive Reliability reports for these models.
0.80
Package Solder Mask
Opening
0.26 mm diameter
0.40 mm diameter
20
19
DETAIL A
18
17
Table 71
Operating Conditions for ADSP-BF523/ADSP-BF525/ADSP-BF527
16
DIAMETER
15
BOTTOM VIEW
* 0.50
14
BALL
0.45
0.40
13
12
11
10
are available for use in automotive applica-
9
INDEX AREA
8
COPLANARITY
0.12
A1 CORNER
7
6
1.36
1.26
1.16
5
4
0.35 NOM
0.30 MIN
3
2
1
B
C
D
E
F
H
K
L
M
N
P
R
T
U
A
G
J
V
W
Y
Package Ball Pad Size
0.35 mm diameter
0.50 mm diameter
Package
Option
BC-208-2
BC-208-2
Instruction
Rate (Max)
400 MHz
533 MHz