DSPIC33FJ32GP204-H/PT Microchip Technology, DSPIC33FJ32GP204-H/PT Datasheet - Page 250

16-bit DSC, 44LD,32KB Flash,40 MIPS,nanoWatt 44 TQFP 10x10x1mm TRAY

DSPIC33FJ32GP204-H/PT

Manufacturer Part Number
DSPIC33FJ32GP204-H/PT
Description
16-bit DSC, 44LD,32KB Flash,40 MIPS,nanoWatt 44 TQFP 10x10x1mm TRAY
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet

Specifications of DSPIC33FJ32GP204-H/PT

Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 13x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 140°C
Package / Case
44-TQFP
Processor Series
dsPIC33F
Core
dsPIC
Data Bus Width
16 bit
Interface Type
SPI, I2C, UART, JTAG
Number Of Programmable I/os
35
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 140 C
Mounting Style
SMD/SMT
Development Tools By Supplier
MPLAB IDE Software
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 13 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC33FJ32GP204-H/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304
TABLE 23-8:
DS70290G-page 250
DC CHARACTERISTICS
HD130 E
HD134 T
Note 1:
Param
No.
2:
Symbol
RETD
P
These parameters are assured by design, but are not characterized or tested in manufacturing.
Programming of the Flash memory is not allowed above 125°C.
DC CHARACTERISTICS: PROGRAM MEMORY
Program Flash Memory
Cell Endurance
Characteristic Retention
Characteristic
(1)
10,000
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Min
20
Typ
Max
-40°C ≤ T
Units
Year
E/W
-40°C to +150°C
1000 E/W cycles or less and no
other specifications are violated
A
≤ +150°C for High Temperature
© 2011 Microchip Technology Inc.
Conditions
(2)

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