MM908E625ACDWB Freescale Semiconductor, MM908E625ACDWB Datasheet - Page 15

• Manufacturer Part Number: MM908E625ACDWB
• Description: IC QUAD HALF BRDG MCU/LIN 54SOIC
• Manufacturer: Freescale Semiconductor

Specifications of MM908E625ACDWB

• Applications: Automotive Mirror Control
• Core Processor: HC08
• Program Memory Type: FLASH (16 kB)
• Controller Series: 908E
• Ram Size: 512 x 8
• Interface: SCI, SPI
• Number Of I /o: 13
• Voltage - Supply: 8 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 54-SOIC (0.300", 7.50mm Width) Exposed Pad
• Program Memory Size: 16 KB
• Number Of Programmable I/os: 54
• Number Of Timers: 16
• Operating Supply Voltage: - 18 V to + 28 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

CURRENT LIMITATION FREQUENCY INPUT PIN
(FGEN)
side inrush current limiter PWM frequency. This input is not a
real PWM input pin; it should just supply the period of the
PWM. The duty cycle will be generate automatically.
be in the range of 0.1 kHz to 20 kHz.
BACK ELECTROMAGNETIC FORCE OUTPUT PIN
(BEMF)
electromagnetic force (BEMF). This feature is mainly used in
step motor applications for detecting a stalled motor. In order
to evaluate this signal the pin must be directly connected to
pin PTD0/TACH0/BEMF.
RESET PIN (RST_A)
an open drain with pull-up resistor and must be connected to
the
INTERRUPT PIN (IRQ_A)
indicating errors or wake-up events. It is an open drain with
pull-up resistor and must be connected to the
MCU.
SLAVE SELECT PIN (SS)
other SPI connections are done internally.
connected to PTB1 or any other logic I/O of the
microcontroller.
LIN BUS PIN (LIN)
receiver. It is suited for automotive bus systems and is based
on the LIN bus specification.
HALF-BRIDGE OUTPUT PINS (HB1:HB4)
configured as four half-bridge driver outputs. The HB1:HB4
outputs may be configured for step motor drivers, DC motor
drivers, or as high-side and low-side switches.
overtemperature protected, and they feature current recopy,
current limitation, and BEMF generation. Current limitation
and recopy are done on the low-side MOSFETs.
POWER SUPPLY PINS (VSUP1:VSUP3)
nominal input voltage is designed for operation from 12 V
Analog Integrated Circuit Device Data
Freescale Semiconductor
Input pin for the half-bridge current limitation and the high-
Important The recommended FGEN frequency should
This pin gives the user information about back
RST_A
IRQ_A
This pin is the SPI Slave Select pin for the analog chip. All
The LIN pin represents the single-wire bus transmitter and
The 908E625 device includes power MOSFETs
The HB1:HB4 outputs are short-circuit and
VSUP1:VSUP3 are device power supply pins. The
RST
pin of the MCU.
is the interrupt output pin of the analog die
is the bidirectional reset pin of the analog die. It is
SS
IRQ
must be
pin of the
systems. Owing to the low ON-resistance and current
requirements of the half-bridge driver outputs and high-side
output driver, multiple VSUP pins are provided.
functionality.
POWER GROUND PINS (GND1 AND GND2)
Owing to the low ON-resistance and current requirements of
the half-bridge driver outputs and high-side output driver,
multiple pins are provided.
functionality.
HIGH-SIDE OUTPUT PIN (HS)
switch is protected against overtemperature and overcurrent.
The output is capable of limiting the inrush current with an
automatic PWM generation using the FGEN module.
SWITCHABLE VDD OUTPUT PIN (HVDD)
resistive loads requiring a regulated 5.0 V supply; e.g., 3-pin
Hall-effect sensors. The output is short-circuit protected.
HALL-EFFECT SENSOR INPUT PINS (H1:H3)
Hall-effect sensors and switches.
+5.0 V VOLTAGE REGULATOR OUTPUT PIN (VDD)
stabilize the regulated output voltage. The VDD pin is
intended to supply the embedded microcontroller.
other loads; use the HVDD pin for this purpose. The VDD,
EVDD, VDDA, and VREFH pins must be connected together.
ANALOG INPUT PIN (PA1)
source values.
VOLTAGE REGULATOR GROUND PIN (VSS)
power ground connections (microcontroller and sensors).
connected together.
LIN TRANSCEIVER OUTPUT PIN (RXD)
connected to the microcontroller’s Enhanced Serial
Communications Interface (ESCI) module (RXD pin).
All VSUP pins must be connected to get full chip
GND1 and GND2 are device power ground connections.
GND1 and GND2 pins must be connected to get full chip
The HS output pin is a low R
The HVDD pin is a switchable V
The Hall-effect sensor input pins H1:H3 provide inputs for
The VDD pin is needed to place an external capacitor to
Important The VDD pin should not be used to supply
This pin is an analog input port with selectable current
The VSS pin is the ground pin for the connection of all non-
Important VSS, EVSS, VSSA, and VREFL pins must be
This pin is the output of LIN transceiver. The pin must be
FUNCTIONAL PIN DESCRIPTION
DS(ON)
FUNCTIONAL DESCRIPTION
DD
output for driving
high-side switch. The
908E625
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