CYIL1SM4000AA-GDC Cypress Semiconductor Corp, CYIL1SM4000AA-GDC Datasheet - Page 25

SENSOR IMAGE 4MP CMOS 127-PGA

CYIL1SM4000AA-GDC

Manufacturer Part Number
CYIL1SM4000AA-GDC
Description
SENSOR IMAGE 4MP CMOS 127-PGA
Manufacturer
Cypress Semiconductor Corp
Type
CMOS Imagingr
Datasheet

Specifications of CYIL1SM4000AA-GDC

Package / Case
127-PGA
Pixel Size
12µm x 12µm
Active Pixel Array
2048H x 2048V
Frames Per Second
15
Voltage - Supply
2.5V, 3.3V
Operating Supply Voltage
2.5 V
Maximum Operating Temperature
+ 60 C
Minimum Operating Temperature
0 C
Image Size
2048 H x 2048 V
Color Sensing
Monochrome
Package
127CPGA
Operating Temperature
0 to 60 °C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
Other names
LUPA-4000-M
LUPA-4000-M
Bonding Diagram
The die is bonded to the bonding pads of the package as shown in
Additional Package Information
Document Number: 38-05712 Rev. *F
Die size: 25610 µm X 27200 µm
Cavity pad: 27000 µm X 29007 µm
Pixel 0,0 is located at 478 µm from the left hand side of the die and 1366 µm from the bottom side of the die.
Figure 24. Bonding Pads Diagram of the LUPA 4000 Package
Figure
24.
CYIL1SM4000AA
001-48359 **
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