BYQ28X-200,127 NXP Semiconductors, BYQ28X-200,127 Datasheet

DIODE RECT UFAST 200V TO220F

BYQ28X-200,127

Manufacturer Part Number
BYQ28X-200,127
Description
DIODE RECT UFAST 200V TO220F
Manufacturer
NXP Semiconductors
Datasheets

Specifications of BYQ28X-200,127

Package / Case
TO-220-3 Full Pack
Voltage - Forward (vf) (max) @ If
1.25V @ 10A
Current - Reverse Leakage @ Vr
10µA @ 200V
Current - Average Rectified (io) (per Diode)
10A
Voltage - Dc Reverse (vr) (max)
200V
Reverse Recovery Time (trr)
25ns
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Diode Configuration
1 Pair Common Cathode
Mounting Type
Through Hole
Product
Ultra Fast Recovery Rectifier
Configuration
Dual Common Cathode
Reverse Voltage
200 V
Forward Voltage Drop
1.1 V
Recovery Time
25 ns
Forward Continuous Current
10 A
Max Surge Current
55 A
Reverse Current Ir
10 uA
Mounting Style
Through Hole
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 40 C
Dc
0632
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-3431
934039600127
BYQ28X-200
Philips Semiconductors
GENERAL DESCRIPTION
Glass
rectifier diodes in a full pack plastic
envelope, featuring low forward
voltage drop, ultra-fast recovery
times
characteristic. They are intended for
use in switched mode power supplies
and high frequency circuits in general
where low conduction and switching
losses are essential.
PINNING - SOT186A
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
1 T
2 Neglecting switching and reverse current losses
August 1996
Rectifier diodes
ultrafast
SYMBOL PARAMETER
V
V
V
I
I
I
I
I
T
T
O(AV)
O(RMS)
FRM
FSM
2
case isolated
PIN
t
stg
j
RRM
RWM
R
hs
1
2
3
148˚C for thermal stability.
passivated
anode 1 (a)
cathode (k)
anode 2 (a)
and
Repetitive peak reverse voltage
Crest working reverse voltage
Continuous reverse voltage
Output current (both diodes
conducting)
RMS forward current
Repetitive peak forward current t = 25 s;
per diode
Non-repetitive peak forward
current per diode
I
Storage temperature
Operating junction temperature
2
DESCRIPTION
t for fusing
soft
dual
2
recovery
epitaxial
QUICK REFERENCE DATA
PIN CONFIGURATION
1
SYMBOL
V
V
I
t
O(AV)
rr
RRM
F
CONDITIONS
square wave
sinusoidal
a = 1.57; T
T
t = 10 ms
t = 8.3 ms
sinusoidal; with reapplied
V
t = 10 ms
hs
RWM(max)
= 0.5; T
92 ˚C
case
PARAMETER
Repetitive peak reverse
voltage
Forward voltage
Output current (both
diodes conducting)
Reverse recovery time
hs
1 2 3
1
hs
= 0.5;
92 ˚C
95 ˚C
BYQ28X-
MIN.
-40
-
-
-
-
-
-
-
-
-
-
-
SYMBOL
MAX.
0.895
100
100
a1
10
25
1
-100
100
100
100
MAX.
0.895
MAX.
BYQ28X series
150
150
Product specification
-150
12.5
10
25
150
150
150
150
150
10
14
10
50
55
9
k
2
MAX.
0.895
-200
200
200
200
200
200
10
25
Rev 1.000
a2
UNIT
UNIT
3
A
˚C
˚C
ns
V
V
V
A
A
A
A
A
A
V
V
A
2
s

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BYQ28X-200,127 Summary of contents

Page 1

... Output current (both O(AV) diodes conducting) t Reverse recovery time rr PIN CONFIGURATION case CONDITIONS 1 square wave = 0. ˚C hs sinusoidal a = 1.57 ˚ 0. ˚ 8.3 ms sinusoidal; with reapplied V RWM(max Product specification BYQ28X series MAX. MAX. MAX. UNIT 100 150 200 100 150 200 V 0.895 0.895 0.895 SYMBOL MIN ...

Page 2

... CONDITIONS 150˚ 100 ˚C R RWM RWM CONDITIONS -dI / -dI /dt = 100 0 0. rec / Product specification BYQ28X series MIN. TYP. MAX. UNIT - 2500 MIN. TYP. MAX. UNIT - - 5.7 K 6.7 K K/W MIN. TYP. MAX. UNIT - 0.80 0.895 V - 0.95 1. 1.10 1. 0.1 0 MIN. TYP. ...

Page 3

... Fig.5. Maximum forward dissipation P fr diode; square current waveform where 0.748 0.0293 Ohms 5 D.U. ’scope Fig.6. Maximum forward dissipation P rr2 diode; sinusoidal current waveform where a = form 3 Product specification BYQ28X series I = 0.25A rec trr2 Fig.4. Definition of t rr2 Ths(max BYQ28 D = 1.0 0.5 0.2 0 ...

Page 4

... Fig.10. Maximum 0.1 0.01 100 10us Fig.11. Transient thermal impedance; per diode; BYQ28 max 1 Product specification BYQ28X series IF=5A IF=2A IF=1A 10 -dIF/dt (A/us ˚C; per diode s j Zth j-hs (K/W) without heatsink compound with heatsink compound 1ms 0.1s ...

Page 5

... Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". August 1996 10.3 max 3.2 3.0 2.8 seating 15.8 19 max. max. plane 3 2 2.54 0.5 5.08 5 Product specification BYQ28X series 4.6 max 2.9 max 6.4 15.8 max 0.6 2.5 1.3 Rev 1.000 1.0 (2x) 0.9 0.7 ...

Page 6

... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. August 1996 6 Product specification BYQ28X series Rev 1.000 ...

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