PCA8802CX8/B/1,027 NXP Semiconductors, PCA8802CX8/B/1,027 Datasheet
PCA8802CX8/B/1,027
Specifications of PCA8802CX8/B/1,027
Related parts for PCA8802CX8/B/1,027
PCA8802CX8/B/1,027 Summary of contents
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PCA8802 Smartcard RTC; ultra low power oscillator with integrated counter for initiating one time password generation Rev. 01 — 19 February 2009 1. General description The PCA8802 is a CMOS integrated circuit for battery operation, typically supplied by button cells ...
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... NXP Semiconductors 4. Ordering information Table 1. Ordering information Type number Package Name PCA8802CX8/B/1 PCA8802CX wafer level chip-size package; 8 bumps; PCA8802U/2AA/1 PCA8802U 5. Marking Table 2. Type number PCA8802CX8/B/1 PCA8802U/2AA/1 6. Block diagram Fig 1. PCA8802_1 Product data sheet Description 1.19 1.14 0.29 mm wafer level chip-size package; 8 bumps; ...
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... NXP Semiconductors 7. Pinning information 7.1 Pinning Fig 2. Fig 3. PCA8802_1 Product data sheet OSCO 4 Top view. For mechanical details, see Figure Pinning diagram of PCA8802CX OSCO 4 Top view. For mechanical details, see Figure Pinning diagram of PCA8802U Rev. 01 — 19 February 2009 PCA8802 PCA8802CX 8 SDA 001aaj257 30 ...
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... NXP Semiconductors 7.2 Pin description Table 3. Symbol INT V DD TEST OSCO OSCI V SS SCL SDA 8. Device protection diagram Fig 4. PCA8802_1 Product data sheet Pin description for PCA8802 Pin OSCI OSCO TEST PCA8802 Diode protection diagram Rev. 01 — 19 February 2009 PCA8802 Smartcard RTC ...
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... NXP Semiconductors 9. Functional description The PCA8802 is an ultra low power device for battery operations. The integrated oscillator circuit generates a between the PCA8802 and other devices is made via an I The device is always running but for longer storage time it can be switched off and on again in case of delivery ...
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... NXP Semiconductors 9.1.2 Low power operation With the power-down instruction (pwd_cmd) the oscillator can be stopped and the device can be put into a low power state where power consumption is reduced to an absolute minimum. The chip would normally reset when the oscillator is stopped prevent a ...
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... NXP Semiconductors 32.768 kHz Fig 7. 9.3 Binary counter A 24 bit binary roll over counter is implemented. The counter is reset at power-on. The counter can be set to any value using the set_cmd instruction. The set_cmd instruction allows partial writing of data. Partial writing of the data parameters will result in partial setting of the counter, e ...
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... NXP Semiconductors 9.4 Pulse generator An interrupt pulse is available at the INT pin. This pulse is generated once every 32 seconds and could be used to wake up a microcontroller to perform a periodic function e.g. to calculate and update an LCD display with a new one-time password. A pulse is generated coincident with the increment of the counter. The new counter value will be available immediately ...
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... NXP Semiconductors writing 2 consecutive instructions S writing 2 consecutive instructions with instruction parameters S S Fig 10. Writing protocol 9.5.1.2 The reading protocol The reading protocol is shown in reading multiple data parameters st S rd_cmd A 1 parameter S START condition P STOP condition A acknowledge from master Rd_cmd is slave address plus read bit. ...
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... NXP Semiconductors 9.5.2 Bit transfer One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as a control signal. Bit transfer is shown in Fig 13 ...
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... NXP Semiconductors 9.5.6 Acknowledge The number of data bytes transferred between the START and STOP conditions from transmitter to receiver is unlimited, but the duration of the access must not exceed 32 seconds. Each byte of eight bits is followed by an acknowledge bit. The acknowledge bit is a HIGH level signal put on the bus by the transmitter during which time the master generates an extra acknowledge related clock pulse ...
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... NXP Semiconductors Fig 18. A master-transmitter addresses a slave receiver Fig 19. A master reads from a slave immediately after the first byte S SLAVE ADDRESS + write or read (1) Not shaded because transfer direction of data and acknowledge bits depends on R/W bits. Fig 20. Combined format 9.5.7.1 Example data transfers ...
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... NXP Semiconductors Example 2: Figure 22 Fig 22. Setting the counter Example 3: RD_CMD master driving SDA slave driving SDA S START condition P STOP condition Rd_cmd is slave address plus read bit. Fig 23. Reading the counter PCA8802_1 Product data sheet Sending dvs_cmd followed by setting the counter to A90001h is shown in ...
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... NXP Semiconductors 9.6 Instructions 9.6.1 Instruction set Table 5. Write instructions The writing protocol is illustrated in First byte Instruction Instruction code Instruction Instruction code Parameters wrt_cmd 1010 0000 Table 6. The reading protocol is illustrated in First byte Instruction Instruction code Parameters rd_cmd [1] Read of the counter is implicit with an interface read. ...
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... NXP Semiconductors When the dividers are restarted, the first increment of the 24 bit counter will be after 32 seconds. 32.768 kHz Fig 24. Instruction dvs_cmd When the dividers are restarted, the 8192 Hz clock could have just occurred and hence a delay of 8192 Hz clock could be just about to occur and immediately increment the divider_2 ...
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... NXP Semiconductors Table 7. Step Action To enter power-down 1 initiate transfer 2 send wrt_cmd 3 enable dvs_cmd 4 set counter with set_cmd 5 enable pwd_cmd 6 end transfer 7 device is now in a power-down state To exit power-down 1 initiate transfer 2 send wrt_cmd 3 disable pwd_cmd 4 disable dvs_cmd 5 end transfer 9.6.5 Instruction 32k_cmd The 32 ...
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... NXP Semiconductors This instruction takes only 3 parameters in one command. Data after the 3rd parameter will be interpreted as the next instruction. Accurate setting and start-up can be implemented using the dvs_cmd instruction in cooperation with the set_cmd instruction. An example is shown in Table 8. Step Action 1 initiate transfer ...
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... NXP Semiconductors 9.7 Reset As described in the exception of a controlled power-down using the pwd_cmd. The state of the device after reset is shown in Table 9. Instruction name dvs_cmd pwd_cmd 32k_cmd fst_cmd 24 bit counter PCA8802_1 Product data sheet Section 9.1, the device will be in reset when the oscillator is stopped with Table 9 ...
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... NXP Semiconductors 10. Limiting values Table 10. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter tot V esd amb T stg [1] Pass level; Human Body Model (HBM) according to JESD22-A114. [2] Pass level; Machine Model (MM), according to JESD22-A115. [3] Pass level; Latch-up testing, according to JESD78. ...
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... NXP Semiconductors 11. Static characteristics Table 11. Static characteristics osc otherwise specified. Symbol Parameter Supplies V supply voltage DD V supply voltage variation DD I supply current DD Oscillator V start voltage start t start-up time startup C integrated load L(itg) capacitance Inputs V LOW-level input voltage IL V HIGH-level input voltage ...
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... NXP Semiconductors Table 11. Static characteristics osc otherwise specified. Symbol Parameter I LOW-level output current OL I output leakage current LO [1] Unless otherwise defined measured with the reset state, see DD [2] Integrated load capacitance, C L(itg) 12. Dynamic characteristics Table 12. Dynamic characteristics Symbol ...
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... NXP Semiconductors t t SU;STA SCL t BUF SDA t HD;STA Fig 26. Serial bus timing waveforms Fig 27. INT timing PCA8802_1 Product data sheet LOW HIGH SCL SU;DAT HD;DAT INT Rev. 01 — 19 February 2009 PCA8802 Smartcard RTC t t VD;DAT SU;STO 001aaj217 t w(int) 001aaj259 © NXP B.V. 2009. All rights reserved. ...
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... NXP Semiconductors 13. Bare die information 13.1 Locations Table 13. Symbol INT V DD TEST OSCO OSCI [ SCL SDA pin 1 identifier bottom left die corner top right die corner [1] All coordinates are referenced the center of the die (see [2] The substrate (rear side of the die) is wired to V [3] Die size before dicing ...
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... NXP Semiconductors solder resist is used on the PCB or foil, then consideration should be given to the amount of run-off of the solder along the track connected to the landing site. Uneven run-off may result in similar problems as described in 1. Fig 29. Example of PCB or foil landing sites PCA8802_1 Product data sheet Rev. 01 — ...
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... NXP Semiconductors 14. Bare die outline WLCSP8: wafer level chip-size package; 8 bumps; 1.19 x 1. Dimensions Unit max 0.105 0.136 mm nom 0.29 0.090 0.2 0.109 min 0.075 0.082 Note 1. Marking code: PC8802-1. Outline version IEC PCA8802CX Fig 30. Bare die outline PCA8802CX PCA8802_1 ...
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... NXP Semiconductors WLCSP8: wafer level chip-size package; 8 bumps; 1.19 x 1. Dimensions Unit max 0.018 mm nom 0.215 0.015 1.19 1.14 0.396 0.448 0.449 min 0.012 Notes 1. Marking code: PC8802- and P : pad size and P : bump size Outline version IEC PCA8802U Fig 31. Bare die outline PCA8802U ...
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... NXP Semiconductors 15. Packing information 15.1 Tray information Fig 32. Tray details for PCA8802U Table 14. Dimension [1] Die is placed in pocket bump side up. PCA8802_1 Product data sheet 1,1 2,1 3,1 1,2 2,2 1,3 F 1,y A [1] Tray dimensions Description pocket pitch; x direction pocket pitch; y direction pocket width; x direction pocket width ...
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... NXP Semiconductors Fig 33. Tray alignment 15.2 Tape and reel Fig 34. Tape and reel details for PCA8802CX Table 15. Dimension [1] Die is placed in pocket bump side down. Fig 35. Pocket alignment for PCA8802CX PCA8802_1 Product data sheet The orientation of the pocket is indicated by the position of the IC type name on the surface of the die, with respect to the cut corner on the upper left of the tray ...
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... NXP Semiconductors 16. Soldering of WLCSP packages 16.1 Introduction to soldering WLCSP packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface mount refl ...
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... NXP Semiconductors Fig 36. Temperature profiles for large and small components For further information on temperature profiles, refer to application note AN10365 “Surface mount reflow soldering description” . 16.3.1 Stand off The stand off between the substrate and the chip is determined by: • ...
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... NXP Semiconductors Device removal can be done when the substrate is heated until it is certain that all solder joints are molten. The chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. Removing the device must be done using plastic tweezers, because metal tweezers can damage the silicon. The surface of the substrate should be carefully cleaned and all solder and fl ...
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... NXP Semiconductors 18. Revision history Table 18. Revision history Document ID Release date PCA8802_1 20090219 PCA8802_1 Product data sheet Data sheet status Change notice Product data sheet - Rev. 01 — 19 February 2009 PCA8802 Smartcard RTC Supersedes - © NXP B.V. 2009. All rights reserved ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Device protection diagram . . . . . . . . . . . . . . . . 4 9 Functional description . . . . . . . . . . . . . . . . . . . 5 9.1 Oscillator 9.1.1 Power-on 9.1.2 Low power operation 9.2 Divider ...