PCA8802CX8/B/1,027 NXP Semiconductors, PCA8802CX8/B/1,027 Datasheet - Page 31

• Manufacturer Part Number: PCA8802CX8/B/1,027
• Description: Real Time Clock ultra LOW POWER OSC Smartcard RTC
• Manufacturer: NXP Semiconductors

Specifications of PCA8802CX8/B/1,027

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935288465027

NXP Semiconductors
17. Abbreviations
PCA8802_1
Product data sheet
16.3.4 Cleaning
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description” .
Cleaning can be done after reflow soldering.
Table 17.
Acronym
CMOS
EMI
HBM
IC
LCD
LSB
MM
MSB
PCB
RTC
WLCSP
Abbreviations
Description
Complementary Metal Oxide Semiconductor
ElectroMagnetic Interference
Human Body Model
Integrated Circuit
Liquid Crystal Display
Least Significant Bit
Machine Model
Most Significant Bit
Printed-Circuit Board
Real Time Clock
Wafer Level Chip-Size Package
Rev. 01 — 19 February 2009
PCA8802
© NXP B.V. 2009. All rights reserved.
Smartcard RTC
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