NTZS3151PT1G ON Semiconductor, NTZS3151PT1G Datasheet

MOSFET P-CH 20V 860MA SOT-563

NTZS3151PT1G

Manufacturer Part Number
NTZS3151PT1G
Description
MOSFET P-CH 20V 860MA SOT-563
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTZS3151PT1G

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
150 mOhm @ 950mA, 4.5V
Drain To Source Voltage (vdss)
20V
Current - Continuous Drain (id) @ 25° C
860mA
Vgs(th) (max) @ Id
1V @ 250µA
Gate Charge (qg) @ Vgs
5.6nC @ 4.5V
Input Capacitance (ciss) @ Vds
458pF @ 16V
Power - Max
170mW
Mounting Type
Surface Mount
Package / Case
SOT-563, SOT-6
Configuration
Single Quad Drain
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
0.15 Ohm @ 4.5 V
Drain-source Breakdown Voltage
20 V
Gate-source Breakdown Voltage
+/- 8 V
Continuous Drain Current
0.86 A
Power Dissipation
170 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NTZS3151PT1GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTZS3151PT1G
Manufacturer:
ON
Quantity:
242
Part Number:
NTZS3151PT1G
Manufacturer:
ON
Quantity:
30 000
Part Number:
NTZS3151PT1G
Manufacturer:
ON/安森美
Quantity:
20 000
Part Number:
NTZS3151PT1G
Manufacturer:
ON
Quantity:
5 512
Part Number:
NTZS3151PT1G
0
Company:
Part Number:
NTZS3151PT1G
Quantity:
12 000
Company:
Part Number:
NTZS3151PT1G
Quantity:
70 000
NTZS3151P
Small Signal MOSFET
−20 V, −950 mA, P−Channel SOT−563
Features
Applications
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in. sq. pad size
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 2
MAXIMUM RATINGS
THERMAL RESISTANCE RATINGS
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain Current
Power Dissipation
Continuous Drain Current
Power Dissipation
Pulsed Drain Current
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
Junction−to−Ambient – Steady State (Note 1)
Junction−to−Ambient – t v 5 s (Note 1)
Low R
Low Threshold Voltage
Small Footprint 1.6 x 1.6 mm
These are Pb−Free Devices
Load/Power Switches
Battery Management
Cell Phones, Digital Cameras, PDAs, Pagers, etc.
(Cu. area = 1.127 in. sq. [1 oz.] including traces).
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(1/8″ from case for 10 s)
DS(on)
Improving System Efficiency
Parameter
Parameter
(T
J
= 25°C unless otherwise noted.)
t v 5 s
Steady
State
Steady State
t
p
t v 5 s
= 10 ms
T
T
T
T
A
A
A
A
= 25°C
= 70°C
= 25°C
= 70°C
Symbol
Symbol
R
R
V
T
V
I
T
P
P
DSS
STG
T
qJA
qJA
I
I
DM
I
GS
D
D
S
J
D
D
L
,
−55 to
Value
−860
−690
−950
−760
−360
Max
720
600
±8.0
−4.0
−20
170
210
150
260
1
°C/W
Unit
Unit
mW
mW
mA
mA
mA
°C
°C
V
V
A
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
V
−20 V
(BR)DSS
(Note: Microdot may be in either location)
6
G
D
D
CASE 463A
SOT−563−6
TX
M
G
ORDERING INFORMATION
2
3
1
G
1
120 mW @ −4.5 V
144 mW @ −2.5 V
195 mW @ −1.8 V
http://onsemi.com
P−Channel MOSFET
PINOUT: SOT−563
R
= Specific Device Code
= Date Code
= Pb−Free Package
DS(on)
Top View
D
S
Typ
Publication Order Number:
MARKING
DIAGRAM
TX M G
NTZS3151P/D
6
5
4
−950 mA
G
I
S
D
D
D
Max

Related parts for NTZS3151PT1G

NTZS3151PT1G Summary of contents

Page 1

NTZS3151P Small Signal MOSFET −20 V, −950 mA, P−Channel SOT−563 Features • Low R Improving System Efficiency DS(on) • Low Threshold Voltage • Small Footprint 1.6 x 1.6 mm • These are Pb−Free Devices Applications • Load/Power Switches • Battery ...

Page 2

ELECTRICAL CHARACTERISTICS Parameter OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage Drain−to−Source Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate−to−Source Leakage Current ON CHARACTERISTICS (Note 2) Gate Threshold Voltage Negative Threshold Temperature Coefficient Drain−to−Source On Resistance Forward Transconductance CHARGES AND CAPACITANCES ...

Page 3

TYPICAL PERFORMANCE CURVES 4 3 − 25° − 2.5 2 1 0.5 1 1.5 2 2.5 3 −V , DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure ...

Page 4

... GATE RESISTANCE (W) G Figure 9. Resistive Switching Time Variation vs. Gate Resistance ORDERING INFORMATION Device NTZS3151PT1G NTZS3151PT5G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifi- cations Brochure, BRD8011/ 25°C unless otherwise noted) ...

Page 5

... Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...

Related keywords