IRFP250NPBF International Rectifier, IRFP250NPBF Datasheet - Page 2

MOSFET N-CH 200V 30A TO-247AC

IRFP250NPBF

Manufacturer Part Number
IRFP250NPBF
Description
MOSFET N-CH 200V 30A TO-247AC
Manufacturer
International Rectifier
Series
HEXFET®r
Type
Power MOSFETr
Datasheets

Specifications of IRFP250NPBF

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
75 mOhm @ 18A, 10V
Drain To Source Voltage (vdss)
200V
Current - Continuous Drain (id) @ 25° C
30A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
123nC @ 10V
Input Capacitance (ciss) @ Vds
2159pF @ 25V
Power - Max
214W
Mounting Type
Through Hole
Package / Case
TO-247-3 (Straight Leads), TO-247AC
Channel Type
N
Current, Drain
30 A
Gate Charge, Total
123 nC
Package Type
TO-247AC
Polarization
N-Channel
Power Dissipation
214 W
Resistance, Drain To Source On
0.075 Ohm
Resistance, Thermal, Junction To Case
0.7 °C/W
Temperature, Operating, Maximum
+175 °C
Temperature, Operating, Minimum
-55 °C
Time, Turn-off Delay
41 ns
Time, Turn-on Delay
14 ns
Transconductance, Forward
17 S
Voltage, Breakdown, Drain To Source
200 V
Voltage, Drain To Source
200 V
Voltage, Forward, Diode
1.3 V
Voltage, Gate To Source
±20 V
Number Of Elements
1
Polarity
N
Channel Mode
Enhancement
Drain-source On-res
0.075Ohm
Drain-source On-volt
200V
Gate-source Voltage (max)
±20V
Continuous Drain Current
30A
Operating Temp Range
-55C to 175C
Operating Temperature Classification
Military
Mounting
Through Hole
Pin Count
3 +Tab
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
200 V
Gate-source Breakdown Voltage
20 V
Mounting Style
Through Hole
Gate Charge Qg
82 nC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
*IRFP250NPBF

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IRFP250NPbF
Source-Drain Ratings and Characteristics
Electrical Characteristics @ T

Notes:
V
∆V
R
V
g
I
I
Q
Q
Q
t
t
t
t
C
C
C
L
L
I
I
V
t
Q
t
DSS
GSS
SM
d(on)
r
d(off)
f
S
rr
on
fs
D
S
(BR)DSS
GS(th)
SD
2
DS(on)
g
gs
gd
iss
oss
rss
rr
Repetitive rating; pulse width limited by
(BR)DSS
max. junction temperature. (See Fig. 11)
R
Starting T
G
= 25Ω, I
/∆T
J
J
Drain-to-Source Leakage Current
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
Internal Drain Inductance
Internal Source Inductance
= 25°C, L = 1.9mH
AS
= 18A. (See Figure 12)

Parameter
Parameter
J
= 25°C (unless otherwise specified)
ƒ
I
Pulse width ≤ 300µs; duty cycle ≤ 2%.
T
200
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
SD
–––
–––
–––
Min. Typ. Max. Units
2.0
Min. Typ. Max. Units
17
–––
–––
–––
–––
–––
–––
J
≤ 175°C
Intrinsic turn-on time is negligible (turn-on is dominated by L
≤ 18A di/d ≤ 374A/µs, V
2159 –––
0.26
–––
–––
–––
–––
–––
–––
––– -100
–––
–––
–––
315
––– 0.075
–––
–––
–––
186
1.3
4.5
83
14
43
41
33
7.5
–––
–––
–––
–––
250
100
123
–––
–––
–––
–––
–––
–––
–––
120
279
4.0
1.3
2.0
25
21
57
30
V/°C
µA
nA
nC
ns
µC
pF
ns
nH
V
V
S
A
V
V
Reference to 25°C, I
V
V
V
V
V
V
V
I
V
V
V
I
R
R
Between lead,
6mm (0.25in.)
from package
and center of die contact
V
V
ƒ = 1.0MHz, See Fig. 5
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
T
di/dt = 100A/µs
D
D
DD
GS
GS
DS
DS
DS
DS
GS
GS
DS
GS
DD
GS
DS
J
J
G
D
= 18A
= 18A
= 25°C, I
= 25°C, I
= 5.5Ω, See Fig. 10 „
= 3.9Ω
≤ V
= 0V, I
= 10V, I
= V
= 50V, I
= 200V, V
= 160V, V
= 20V
= -20V
= 160V
= 10V, See Fig. 6 and 13
= 100V
= 0V
= 25V
(BR)DSS
GS
, I
D
S
F
D
D
D
Conditions
= 250µA
Conditions
= 18A
= 18A, V
,
= 18A
= 250µA
= 18A „
GS
GS
= 0V
= 0V, T
D
GS
= 1mA
www.irf.com
J
= 0V
G
= 150°C
G
S
+L
D
S
D
)
S
D

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