IRF9Z14STRL Vishay, IRF9Z14STRL Datasheet

MOSFET P-CH 60V 6.7A D2PAK

IRF9Z14STRL

Manufacturer Part Number
IRF9Z14STRL
Description
MOSFET P-CH 60V 6.7A D2PAK
Manufacturer
Vishay
Datasheet

Specifications of IRF9Z14STRL

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
500 mOhm @ 4A, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
6.7A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
12nC @ 10V
Input Capacitance (ciss) @ Vds
270pF @ 25V
Power - Max
3.7W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Note
a. See device orientation.
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
c. I
d. 1.6 mm from case.
e. Uses IRF9Z14, SiHF9Z14 data and test conditions.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91089
S09-0071-Rev. A, 02-Feb-09
I
PRODUCT SUMMARY
V
R
Q
Q
Q
Configuration
ORDERING INFORMATION
Package
Lead (Pb)-free
SnPb
ABSOLUTE MAXIMUM RATINGS T
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Linear Derating Factor
Single Pulse Avalanche Energy
Avalanche Current
Repetiitive Avalanche Energy
Maximum Power Dissipation
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
2
PAK
DS
DS(on)
g
gs
gd
SD
DD
(Max.) (nC)
(nC)
(nC)
(V)
≤ - 6.7 A, dI/dt ≤ 90 A/µs, V
= - 25 V, starting T
(TO-262)
(Ω)
G
D
S
a
G
a, e
D
D
2
J
PAK (TO-263)
e
S
= 25 °C, L = 3.6 mH, R
c, e
a
V
b, e
DD
GS
≤ V
D
IRF9Z14SPbF
SiHF9Z14S-E3
IRF9Z14S
SiHF9Z14S
= - 10 V
2
PAK (TO-263)
DS
, T
G
Single
J
- 60
≤ 175 °C.
3.8
5.1
IRF9Z14S, SiHF9Z14S, IRF9Z14L, SiHF9Z14L
12
P-Channel MOSFET
G
= 25 Ω, I
C
Power MOSFET
V
= 25 °C, unless otherwise noted
S
0.50
D
GS
at - 10 V
AS
T
= - 6.7 A (see fig. 12).
T
for 10 s
C
A
= 25 °C
= 25 °C
T
T
C
C
D
IRF9Z14STRLPbF
SiHF9Z14STL-E3
IRF9Z14STRL
SiHF9Z14STL
= 100 °C
= 25 °C
2
FEATURES
• Advanced Process Technology
• Surface Mount (IRF9Z14S, SiHF9Z14S)
• Low-ProfileThrough-Hole (IRF9Z14L, SiHF9Z14L)
• 175 °C Operating Temperature
• Fast Switching
• P-Channel
• Fully Avalanche Rated
• Lead (Pb)-free Available
DESCRIPTION
Third generation Power MOSFETs from Vishay utilize
advanced processing techniques to achieve extremely low
on-resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
Power MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use in a
wide variety of applications.
The D
accommodating die size up to HEX-4. It provides the highest
power capability and the lowest possible on-resistance in
any existing surface mount package. The D
for high current applications because of is low internal
connection resistance and can dissipate up to 2.0 W in a
typical surface mount application.
The through-hole version (IRF9Z14L, SiHF9Z14L) is
available for low-profile applications.
PAK (TO-263)
2
PAK is a surface mount power package capable of
SYMBOL
a
a
T
dV/dt
J
V
V
E
E
I
I
P
, T
I
DM
AR
a
DS
GS
AS
AR
D
a
D
stg
- 55 to + 175
I
IRF9Z14LPbF
SiHF9Z14L-E3
-
-
2
PAK (TO-262)
LIMIT
300
± 20
- 6.7
- 4.7
0.29
- 6.7
- 4.5
- 60
- 27
140
4.3
3.7
43
Vishay Siliconix
d
2
PAK is suitable
www.vishay.com
UNIT
W/°C
RoHS*
V/ns
COMPLIANT
mJ
mJ
°C
W
V
A
A
Available
1

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IRF9Z14STRL Summary of contents

Page 1

... D connection resistance and can dissipate typical surface mount application. P-Channel MOSFET The through-hole version (IRF9Z14L, SiHF9Z14L) is available for low-profile applications PAK (TO-263) IRF9Z14STRLPbF SiHF9Z14STL-E3 IRF9Z14STRL SiHF9Z14STL = 25 °C, unless otherwise noted ° 100 °C ...

Page 2

... IRF9Z14S, SiHF9Z14S, IRF9Z14L, SiHF9Z14L Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER Maximum Junction-to-Ambient (PCB a Mounted, steady-state) Maximum Junction-to-Case (Drain) Note a. When mounted on 1" square PCB (FR-4 or G-10 material). SPECIFICATIONS °C, unless otherwise noted J PARAMETER Static Drain-Source Breakdown Voltage V Temperature Coefficient DS Gate-Source Threshold Voltage ...

Page 3

... Pulse Width - Drain-to-Source Voltage ( 91089_02 Fig Typical Output Characteristics Document Number: 91089 S09-0071-Rev. A, 02-Feb-09 IRF9Z14S, SiHF9Z14S, IRF9Z14L, SiHF9Z14L - 4 ° 91089_03 - 4 175 ° 91089_04 Vishay Siliconix 1 10 ° ° 175 µs Pulse Width Gate-to-Source Voltage ( Fig Typical Transfer Characteristics 3 6.7 A ...

Page 4

... IRF9Z14S, SiHF9Z14S, IRF9Z14L, SiHF9Z14L Vishay Siliconix 600 MHz iss rss gd 480 oss ds 360 240 120 Drain-to-Source Voltage ( 91089_05 Fig Typical Capacitance vs. Drain-to-Source Voltage 6 Total Gate Charge (nC) 91089_06 G Fig Typical Gate Charge vs. Gate-to-Source Voltage www.vishay.com Shorted iss C oss C rss 91089_07 For test circuit ...

Page 5

... Fig. 12a - Unclamped Inductive Test Circuit Document Number: 91089 S09-0071-Rev. A, 02-Feb-09 IRF9Z14S, SiHF9Z14S, IRF9Z14L, SiHF9Z14L 125 150 175 Single Pulse (Thermal Response Rectangular Pulse Duration ( Vishay Siliconix D.U. Pulse width ≤ 1 µs Duty factor ≤ 0.1 % Fig. 10a - Switching Time Test Circuit ...

Page 6

... IRF9Z14S, SiHF9Z14S, IRF9Z14L, SiHF9Z14L Vishay Siliconix Charge Fig. 13a - Basic Gate Charge Waveform www.vishay.com 6 500 Top 400 Bottom 300 200 100 125 100 Starting T , Junction Temperature (°C) 91089_12c J Fig. 12c - Maximum Avalanche Energy vs. Drain Current 2 4 6.7 A 150 175 Current regulator Same type as D.U.T. 50 kΩ ...

Page 7

... Inductor current * V Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91089. ...

Page 8

... Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’ ...

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