MW6S004NT1 Freescale Semiconductor, MW6S004NT1 Datasheet - Page 12

MOSFET RF N-CH 28V 4W PLD-1.5

MW6S004NT1

Manufacturer Part Number
MW6S004NT1
Description
MOSFET RF N-CH 28V 4W PLD-1.5
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MW6S004NT1

Transistor Type
N-Channel
Frequency
1.96GHz
Gain
18dB
Voltage - Rated
68V
Current Rating
10µA
Current - Test
50mA
Voltage - Test
28V
Power - Output
4W
Package / Case
PLD-1.5
Configuration
Single Dual Source
Drain-source Breakdown Voltage
68 V
Gate-source Breakdown Voltage
- 0.5 V or 12 V
Maximum Operating Temperature
+ 200 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Transistor Polarity
N-Channel
Drain Source Voltage Vds
68V
Rf Transistor Case
PLD-1.5
Termination Type
SMD
Output Power Pout
4W
Peak Reflow Compatible (260 C)
Yes
Rohs Compliant
Yes
Channel Type
N
Channel Mode
Enhancement
Drain Source Voltage (max)
68V
Power Gain (typ)@vds
19dB
Frequency (min)
1MHz
Frequency (max)
2GHz
Package Type
PLD-1.5
Pin Count
3
Input Capacitance (typ)@vds
23@28VpF
Output Capacitance (typ)@vds
25@28VpF
Reverse Capacitance (typ)
21@28VpF
Operating Temp Range
-65C to 150C
Drain Efficiency (typ)
33%
Mounting
Surface Mount
Mode Of Operation
2-Tone
Number Of Elements
1
Vswr (max)
5
Screening Level
Military
Filter Terminals
SMD
Gate-source Voltage
12V
Leaded Process Compatible
Yes
Operating Frequency Max
1.96GHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Noise Figure
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MW6S004NT1
MW6S004NT1TR

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Application Notes
• AN1955: Thermal Measurement Methodology of RF Power Amplifiers
Engineering Bulletins
• EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
• Electromigration MTTF Calculator
• RF High Power Model
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the
Software & Tools tab on the part’s Product Summary page to download the respective tool.
MW6S004NT1
12
Revision
Refer to the following documents to aid your design process.
The following table summarizes revisions to this document.
2
3
4
June 2009
Feb. 2007
Apr. 2009
Date
• Corrected MSL Rating from 3 to 1 in Table 4, Moisture Sensitivity Level, p. 2
• Updated V
• Updated Part Numbers in Table 6, Component Designations and Values, to RoHS compliant part
• Removed lower voltage tests from Fig. 10, Power Gain versus Output Power, due to fixed tuned fixture
• Replaced Figure 12, MTTF versus Junction Temperature with updated graph. Removed Amps
• Added Product Documentation and Revision History section, p. 12
• Corrected ESD structures to reflect current testing results. Changed HBM from 1A to 1C and CDM from III
• Corrected C
• Updated PCB information to show more specific material details, Fig. 1, Test Circuit Schematic, p. 3
• Updated Part Numbers in Table 6, Component Designations and Values, to latest RoHS compliant part
• Modified data sheet to reflect MSL rating change from 1 to 3 as a result of the standardization of packing
• Added Electromigration MTTF Calculator and RF High Power Model availability to Product Documentation,
Characteristics table to account for test fixture resistor divider network, p. 2
numbers, p. 3
limitations, p. 6
operating characteristics and location of MTTF calculator for device, p. 7
to IV, p. 1
Dynamic Characteristics table, p. 2
numbers, p. 3
process as described in Product and Process Change Notification number, PCN13516, p. 2
Tools and Software, p. 12
PRODUCT DOCUMENTATION, TOOLS AND SOFTWARE
GS(th)
iss
test condition to indicate AC stimulus on the V
and V
GS(Q)
REVISION HISTORY
to reflect tighter HV6 windows and added Fixture Gate Quiescent V
Description
GS
connection versus the V
Freescale Semiconductor
DS
RF Device Data
connection,
2
and listed
GG(Q)
to On

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