MRF7S38010HR3 Freescale Semiconductor, MRF7S38010HR3 Datasheet - Page 2

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MRF7S38010HR3

Manufacturer Part Number
MRF7S38010HR3
Description
MOSFET RF N-CH 2W 30V NI-400
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MRF7S38010HR3

Transistor Type
N-Channel
Frequency
3.4GHz
Gain
15dB
Voltage - Rated
65V
Current Rating
10µA
Current - Test
160mA
Voltage - Test
30V
Power - Output
2W
Package / Case
NI-400
Channel Type
N
Channel Mode
Enhancement
Drain Source Voltage (max)
65V
Output Power (max)
2W
Power Gain (typ)@vds
15dB
Frequency (min)
3.4GHz
Frequency (max)
3.8GHz
Package Type
NI-400-240
Pin Count
3
Input Capacitance (typ)@vds
50.6@28VpF
Output Capacitance (typ)@vds
68.5@28VpF
Reverse Capacitance (typ)
0.13@28VpF
Operating Temp Range
-65C to 225C
Drain Efficiency (typ)
17%
Mounting
Screw
Mode Of Operation
BWA/OFDM/WIBRO/WIMAX
Number Of Elements
1
Vswr (max)
10
Screening Level
Military
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Noise Figure
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MRF7S38010HR3
Manufacturer:
POWER
Quantity:
20 000
MRF7S38010HR3 MRF7S38010HSR3
2
Table 3. ESD Protection Characteristics
Table 4. Electrical Characteristics
Off Characteristics
On Characteristics
Dynamic Characteristics
Functional Tests (In Freescale Test Fixture, 50 ohm system) V
WiMAX Signal, 802.16d, 7 MHz Channel Bandwidth, 64 QAM
0.5 MHz Channel Bandwidth @ ±5.25 MHz Offset.
Human Body Model (per JESD22 - A114)
Machine Model (per EIA/JESD22 - A115)
Charge Device Model (per JESD22 - C101)
Zero Gate Voltage Drain Leakage Current
Zero Gate Voltage Drain Leakage Current
Gate - Source Leakage Current
Gate Threshold Voltage
Gate Quiescent Voltage
Drain - Source On - Voltage
Reverse Transfer Capacitance
Output Capacitance
Input Capacitance
Power Gain
Drain Efficiency
Output Peak - to - Average Ratio @ 0.01% Probability on CCDF
Adjacent Channel Power Ratio
Input Return Loss
1. Part internally matched both on input and output.
(V
(V
(V
(V
(V
(V
(V
(V
(V
DS
DS
GS
DS
DD
GS
DS
DS
DS
= 65 Vdc, V
= 28 Vdc, V
= 5 Vdc, V
= 10 Vdc, I
= 30 Vdc, I
= 28 Vdc ± 30 mV(rms)ac @ 1 MHz, V
= 28 Vdc ± 30 mV(rms)ac @ 1 MHz, V
= 28 Vdc, V
= 10 Vdc, I
DS
D
D
D
GS
GS
GS
= 33.5 μAdc)
= 160 mAdc, Measured in Functional Test)
= 335 mAdc)
= 0 Vdc)
= 0 Vdc)
= 0 Vdc)
= 0 Vdc ± 30 mV(rms)ac @ 1 MHz)
(1)
Characteristic
Test Methodology
(T
C
= 25°C unless otherwise noted)
GS
GS
= 0 Vdc)
= 0 Vdc)
3
/
DD
4
, 4 Bursts, PAR = 9.5 dB @ 0.01% Probability on CCDF. ACPR measured in
= 30 Vdc, I
DQ
Symbol
V
V
V
ACPR
I
I
I
C
PAR
DS(on)
C
GS(th)
GS(Q)
C
G
IRL
DSS
DSS
GSS
= 160 mA, P
η
oss
rss
iss
ps
D
out
Min
1.2
0.1
13
15
2
8
= 2 W Avg., f = 3400 MHz and f = 3600 MHz,
0.21
0.13
68.5
50.6
Typ
- 49
- 12
2.7
8.5
15
17
1C (Minimum)
2
IV (Minimum)
A (Minimum)
Class
Freescale Semiconductor
Max
- 46
2.7
3.5
0.3
10
17
30
- 6
1
1
RF Device Data
(continued)
μAdc
μAdc
μAdc
Unit
Vdc
Vdc
Vdc
dBc
dB
dB
dB
pF
pF
pF
%

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