MCR08BT1,115 NXP Semiconductors, MCR08BT1,115 Datasheet

MCR08BT1,115

Manufacturer Part Number

MCR08BT1,115

Description

THYRISTOR 0.8A 200V SOT223

Manufacturer

NXP Semiconductors

Type

SCRr

Datasheet

1.MCR08BT1115.pdf (12 pages)

Specifications of MCR08BT1,115

Package / Case

SOT-223 (3 leads + Tab), SC-73, TO-261

Scr Type

Sensitive Gate

Voltage - Off State

200V

Voltage - Gate Trigger (vgt) (max)

800mV

Voltage - On State (vtm) (max)

1.7V

Current - On State (it (av)) (max)

500mA

Current - On State (it (rms)) (max)

800mA

Current - Gate Trigger (igt) (max)

200µA

Current - Hold (ih) (max)

5mA

Current - Off State (max)

100µA

Current - Non Rep. Surge 50, 60hz (itsm)

8A, 9A

Mounting Type

Surface Mount

Current - On State (it (rms) (max)

800mA

Breakover Current Ibo Max

9 A

Rated Repetitive Off-state Voltage Vdrm

200 V

Off-state Leakage Current @ Vdrm Idrm

0.1 mA

Forward Voltage Drop

1.7 V

Gate Trigger Voltage (vgt)

0.8 V

Maximum Gate Peak Inverse Voltage

5 V

Gate Trigger Current (igt)

0.2 mA

Holding Current (ih Max)

5 mA

Mounting Style

SMD/SMT

Repetitive Peak Off-state Volt

200V

Off-state Voltage

200V

Average On-state Current

500mA

Hold Current

5mA

Gate Trigger Current (max)

200uA

Gate Trigger Voltage (max)

800mV

Peak Reverse Gate Voltage

Package Type

SC-73

Peak Repeat Off Current

100uA

Peak Surge On-state Current (max)

On State Voltage(max)

1.7@1.2AV

Mounting

Surface Mount

Pin Count

3 +Tab

Operating Temp Range

-40C to 125C

Operating Temperature Classification

Automotive

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Lead Free Status / RoHS Status

Lead free / RoHS Compliant, Lead free / RoHS Compliant

Other names

934056931115
MCR08BT1 T/R
MCR08BT1 T/R

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1. Product proﬁle

2. Pinning information

Table 1:

3. Ordering information

Table 2:

Type number

MCR08BT1

SOT223

Pinning

Ordering information

1.1 General description

1.2 Features

1.3 Applications

1.4 Quick reference data

Description

cathode

anode

gate

anode

Package

Name

SC-73

Passivated, sensitive gate thyristor in a SOT223 plastic package.

MCR08BT1

Thyristor; logic level

Rev. 03 — 29 November 2004

Sensitive gate

Surface mount package.

General purpose switching and phase control

Designed to be interfaced directly to microcontrollers, logic integrated circuits and low

power gate trigger circuits.

T(AV)

DRM,

= 50 A (typ).

Description

plastic surface mounted package with increased heat sink; 4 leads

0.5 A

RRM

200 V

Simpliﬁed outline

SOT223 (SC-73)

T(RMS)

TSM

9 A

0.8 A

Product data sheet

Symbol

sym037

Version

SOT223

Related parts for MCR08BT1,115

MCR08BT1,115 Summary of contents

Page 1

MCR08BT1 Thyristor; logic level Rev. 03 — 29 November 2004 SOT223 1. Product proﬁle 1.1 General description Passivated, sensitive gate thyristor in a SOT223 plastic package. 1.2 Features Sensitive gate Surface mount package. 1.3 Applications General purpose switching and phase ...

Page 2

Philips Semiconductors 4. Limiting values Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter repetitive peak off-state voltage DRM RRM I average on-state current T(AV) I RMS on-state current T(RMS) ...

Page 3

Philips Semiconductors 10 I TSM ( Hz. Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values TSM (A) 2 ...

Page 4

Philips Semiconductors 2.0 I T(RMS) (A) 1.5 1.0 0 Hz; T 112 C. sp Fig 4. RMS on-state current as a function of surge duration for sinusoidal currents; maximum values 5. Thermal ...

Page 5

Philips Semiconductors th(j-sp) (K/ Fig 6. Transient thermal impedance from junction to solder point as a function of pulse duration 6. Characteristics Table 5: Characteristics T = ...

Page 6

Philips Semiconductors 1.6 V GT(Tj) V GT(25 C) 1.2 0.8 0 Fig 7. Normalized gate trigger voltage as a function of junction temperature ( (1) (2) (3) 0 0.4 1.2 ...

Page 7

Philips Semiconductors 3 I H(Tj Fig 11. Normalized holding current as a function of junction temperature. 7. Package information Epoxy meets requirements of UL94 V-0 ...

Page 8

Philips Semiconductors 8. Package outline Plastic surface mounted package with increased heatsink; 4 leads DIMENSIONS (mm are the original dimensions) A UNIT 1.8 0.10 0.80 3.1 mm 1.5 0.01 0.60 ...

Page 9

Philips Semiconductors 9. Mounting 9.1 Mounting instructions Fig 14. SOT223: minimum footprint 9397 750 13513 Product data sheet 1.5 min 1.5 min (3 ) 1.5 min Dimensions in mm. Rev. 03 — 29 November 2004 MCR08BT1 Thyristor; logic level 3.8 ...

Page 10

Philips Semiconductors 10. Revision history Table 6: Revision history Document ID Release date MCR08BT1_3 20041129 • Modiﬁcations: The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors • Table ...

Page 11

Philips Semiconductors 11. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualiﬁcation III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

Page 12

Philips Semiconductors 15. Contents 1 Product proﬁ 1.1 General description ...

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