PMBT3946VPN,115 NXP Semiconductors, PMBT3946VPN,115 Datasheet - Page 3

• Manufacturer Part Number: PMBT3946VPN,115
• Description: TRANS NPN/PNP 40V 200MA SOT666
• Manufacturer: NXP Semiconductors

Specifications of PMBT3946VPN,115

• Package / Case: SS Mini-6 (SOT-666)
• Transistor Type: NPN, PNP
• Current - Collector (ic) (max): 200mA
• Voltage - Collector Emitter Breakdown (max): 40V
• Vce Saturation (max) @ Ib, Ic: 300mV @ 5mA, 50mA / 400mV @ 5mA, 50mA
• Dc Current Gain (hfe) (min) @ Ic, Vce: 100 @ 10mA, 1V
• Power - Max: 240mW
• Frequency - Transition: 300MHz, 250MHz
• Mounting Type: Surface Mount
• Dc Collector/base Gain Hfe Min: 180
• Minimum Operating Temperature: - 55 C
• Configuration: Dual
• Transistor Polarity: NPN/PNP
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: 40 V
• Emitter- Base Voltage Vebo: 6 V
• Continuous Collector Current: 200 mA
• Maximum Dc Collector Current: 200 mA
• Power Dissipation: 240 mW
• Maximum Operating Frequency: 300 MHz
• Maximum Operating Temperature: + 150 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Collector Cutoff (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 934063474115

NXP Semiconductors
6. Thermal characteristics
PMBT3946VPN_1
Product data sheet
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
Table 7.
[1]
[2]
Symbol
Per device
P
T
T
T
Symbol
Per transistor
R
R
Per device
R
Fig 1.
j
amb
stg
tot
th(j-a)
th(j-sp)
th(j-a)
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
FR4 PCB, standard footprint
Per device: Power derating curves SOT666
Parameter
total power dissipation
junction temperature
ambient temperature
storage temperature
Limiting values
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
thermal resistance from
junction to ambient
(mW)
P
Rev. 01 — 31 August 2009
tot
400
300
200
100
0
…continued
75
25
25
Conditions
in free air
in free air
Conditions
T
40 V, 200 mA NPN/PNP switching transistor
amb
75
25 C
125
T
006aab604
amb
PMBT3946VPN
[1][2]
[1][2]
[1][2]
( C)
175
Min
-
-
Min
-
-
-
55
65
Typ
-
-
-
© NXP B.V. 2009. All rights reserved.
Max
360
150
+150
+150
Max
521
100
347
Unit
mW
C
C
C
Unit
K/W
K/W
K/W
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