BCM847DS,115 NXP Semiconductors, BCM847DS,115 Datasheet - Page 10

• Manufacturer Part Number: BCM847DS,115
• Description: TRANS NPN/NPN 45V 100MA SC74
• Manufacturer: NXP Semiconductors

Specifications of BCM847DS,115

• Package / Case: SC-74-6
• Mounting Type: Surface Mount
• Power - Max: 380mW
• Current - Collector (ic) (max): 100mA
• Voltage - Collector Emitter Breakdown (max): 45V
• Transistor Type: 2 NPN (Dual)
• Frequency - Transition: 250MHz
• Dc Current Gain (hfe) (min) @ Ic, Vce: 200 @ 2mA, 5V
• Vce Saturation (max) @ Ib, Ic: 400mV @ 5mA, 100mA
• Minimum Operating Temperature: - 65 C
• Configuration: Dual
• Transistor Polarity: NPN
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: 45 V
• Emitter- Base Voltage Vebo: 6 V
• Maximum Dc Collector Current: 0.1 A
• Power Dissipation: 380 mW
• Maximum Operating Frequency: 250 MHz
• Maximum Operating Temperature: + 150 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Collector Cutoff (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 934059058115::BCM847DS T/R::BCM847DS T/R

NXP Semiconductors
11. Soldering
BCM847BV_BS_DS_6
Product data sheet
Fig 14. Reflow soldering footprint SOT666
Fig 15. Reflow soldering footprint SOT363 (SC-88)
2
1.7
1.075
2.35
Reflow soldering is the only recommended soldering method.
0.538
1.5
(4 )
0.6
0.55
(2 )
(4 )
0.5
Rev. 06 — 28 August 2009
0.45
(4 )
(4 )
0.5
(4 )
(4 )
0.5
0.6
2.65
1.8
2.75
2.45
2.1
1.6
1.7
(2 )
0.6
0.65
(2 )
(2 )
0.6
0.4 (2 )
NPN/NPN matched double transistors
BCM847BV/BS/DS
(6 )
0.4
0.325
0.25
(2 )
(4 )
0.375
(2 )
(4 )
0.3
Dimensions in mm
Dimensions in mm
© NXP B.V. 2009. All rights reserved.
solder lands
solder resist
solder paste
occupied area
sot363_fr
solder lands
placement area
solder paste
occupied area
sot666_fr
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