MT46H16M16LFBF-6:H Micron Technology Inc, MT46H16M16LFBF-6:H Datasheet - Page 92

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MT46H16M16LFBF-6:H

Manufacturer Part Number
MT46H16M16LFBF-6:H
Description
DRAM Chip DDR SDRAM 256M-Bit 16Mx16 1.8V 60-Pin VFBGA Tray
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Series
-r

Specifications of MT46H16M16LFBF-6:H

Package
60VFBGA
Density
256 Mb
Address Bus Width
15 Bit
Operating Supply Voltage
1.8 V
Maximum Clock Rate
166 MHz
Maximum Random Access Time
6.5|5 ns
Operating Temperature
0 to 70 °C
Format - Memory
RAM
Memory Type
Mobile DDR SDRAM
Memory Size
256M (16Mx16)
Speed
166MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.95 V
Package / Case
60-VFBGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT46H16M16LFBF-6:H
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Company:
Part Number:
MT46H16M16LFBF-6:H
Quantity:
568
Part Number:
MT46H16M16LFBF-6:H TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Figure 52: Deep Power-Down Mode
PDF: 09005aef834bf85b
256mb_mobile_ddr_sdram_t36n.pdf - Rev. H 11/09 EN
Command
CKE
CK#
CK
All banks idle with no
activity on the data bus
1
Notes:
NOP
T0
1. Clock must be stable prior to CKE going HIGH.
2. DPD = deep power-down.
3. Upon exit of deep power-down mode, a full DRAM initialization sequence is required.
t
IS
DPD
T1
Enter deep power-down mode
2
T2
(
(
(
)
(
)
(
t
)
)
)
(
CKE
(
(
(
)
(
)
)
)
)
92
256Mb: x16, x32 Mobile LPDDR SDRAM
Ta0
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
NOP
Ta1
Exit deep power-down mode
T = 200µs
©2008 Micron Technology, Inc. All rights reserved.
Ta2
NOP
Power-Down
Don’t Care
Ta3
PRE
3

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