XC2VP7-5FFG672C Xilinx Inc, XC2VP7-5FFG672C Datasheet - Page 68
![FPGA Virtex-II Pro™ Family 11088 Cells 1050MHz 0.13um/90nm (CMOS) Technology 1.5V 672-Pin FCBGA](/photos/6/74/67431/xc2vp7-5ffg672c_sml.jpg)
XC2VP7-5FFG672C
Manufacturer Part Number
XC2VP7-5FFG672C
Description
FPGA Virtex-II Pro™ Family 11088 Cells 1050MHz 0.13um/90nm (CMOS) Technology 1.5V 672-Pin FCBGA
Manufacturer
Xilinx Inc
Series
Virtex™-II Pror
Datasheet
1.XC2VP20-5FGG676C.pdf
(430 pages)
Specifications of XC2VP7-5FFG672C
Package
672FCBGA
Family Name
Virtex-II ProÂ
Device Logic Units
11088
Number Of Registers
9856
Maximum Internal Frequency
1050 MHz
Typical Operating Supply Voltage
1.5 V
Maximum Number Of User I/os
396
Ram Bits
811008
Number Of Logic Elements/cells
11088
Number Of Labs/clbs
1232
Total Ram Bits
811008
Number Of I /o
396
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
672-BBGA, FCBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
122-1370
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC2VP7-5FFG672C
Manufacturer:
XILINX
Quantity:
745
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Master SelectMAP Mode
This mode is a master version of the SelectMAP mode. The
device is configured byte-wide on a CCLK supplied by the
Virtex-II Pro FPGA device. Timing is similar to the Slave
SerialMAP mode except that CCLK is supplied by the
Virtex-II Pro FPGA.
Boundary-Scan (JTAG, IEEE 1532) Mode
In Boundary-Scan mode, dedicated pins are used for con-
figuring the Virtex-II Pro device. The configuration is done
entirely through the IEEE 1149.1 Test Access Port (TAP).
Table 32: Virtex-II Pro Configuration Mode Pin Settings
Table 33
configure each device.
Table 33: Virtex-II Pro Default Bitstream Lengths
Configuration Sequence
The configuration of Virtex-II Pro devices is a three-phase
process. First, the configuration memory is cleared. Next,
configuration data is loaded into the memory, and finally, the
logic is activated by a start-up process.
DS083 (v4.7) November 5, 2007
Product Specification
Notes:
1. The HSWAP_EN pin controls the pull-ups. Setting M2, M1, and M0 selects the configuration mode, while the HSWAP_EN pin
2. Daisy chaining is possible only in modes where Serial D
Master Serial
Slave Serial
Master SelectMAP
Slave SelectMAP
Boundary-Scan
controls whether or not the pull-ups are used.
support daisy chaining of downstream devices.
Configuration Mode
XC2VPX20
XC2VPX70
XC2VP100
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP2
XC2VP4
XC2VP7
lists the default total number of bits required to
Device
R
(1)
Number of Configuration
11,589,920
15,868,192
19,021,344
26,098,976
26,098,976
34,292,768
1,305,376
3,006,496
4,485,408
8,214,560
8,214,560
M2
0
1
0
1
1
Bits
Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Functional Description
M1
1
0
0
1
1
www.xilinx.com
OUT
is used. For example, in SelectMAP modes, the first device does NOT
M0
0
1
0
1
1
Virtex-II Pro device configuration using Boundary-Scan is
compatible with with IEEE 1149.1-1993 standard and the
new IEEE 1532 standard for In-System Configurable (ISC)
devices. The IEEE 1532 standard is backward compliant
with the IEEE 1149.1-1993 TAP and state machine. The
IEEE Standard 1532 for In-System Configurable (ISC)
devices is intended to be programmed, reprogrammed, or
tested on the board via a physical and logical protocol. Con-
figuration through the Boundary-Scan port is always avail-
able, independent of the mode selection. Selecting the
Boundary-Scan mode simply turns off the other modes.
Configuration is automatically initiated on power-up unless
it is delayed by the user. The INIT_B pin can be held Low
using an open-drain driver. An open-drain is required since
INIT_B is a bidirectional open-drain pin that is held Low by a
Virtex-II Pro FPGA device while the configuration memory
is being cleared. Extending the time that the pin is Low
causes the configuration sequencer to wait. Thus, configu-
ration is delayed by preventing entry into the phase where
data is loaded.
The configuration process can also be initiated by asserting
the PROG_B pin. The end of the memory-clearing phase is
signaled by the INIT_B pin going High, and the completion
of the entire process is signaled by the DONE pin going
High. The Global Set/Reset (GSR) signal is pulsed after the
last frame of configuration data is written but before the
start-up sequence. The GSR signal resets all flip-flops on
the device.
The default start-up sequence is that one CCLK cycle after
DONE goes High, the global 3-state signal (GTS) is
released. This permits device outputs to turn on as neces-
sary. One CCLK cycle later, the Global Write Enable (GWE)
signal is released. This permits the internal storage ele-
ments to begin changing state in response to the logic and
the user clock.
The relative timing of these events can be changed via con-
figuration options in software. In addition, the GTS and
GWE events can be made dependent on the DONE pins of
multiple devices all going High, forcing the devices to start
CCLK Direction
Out
Out
N/A
In
In
Data Width
1
1
8
8
1
Serial D
Module 2 of 4
Yes
Yes
No
No
No
OUT
(2)
57
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