XC3S1600E-5FGG400C Xilinx Inc, XC3S1600E-5FGG400C Datasheet - Page 171
XC3S1600E-5FGG400C
Manufacturer Part Number
XC3S1600E-5FGG400C
Description
FPGA Spartan®-3E Family 1.6M Gates 33192 Cells 657MHz 90nm (CMOS) Technology 1.2V 400-Pin FBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3Er
Datasheet
1.XC3S100E-4VQG100C.pdf
(233 pages)
Specifications of XC3S1600E-5FGG400C
Package
400FBGA
Family Name
Spartan®-3E
Device Logic Cells
33192
Device Logic Units
3688
Device System Gates
1600000
Number Of Registers
29504
Maximum Internal Frequency
657 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
304
Ram Bits
663552
Number Of Logic Elements/cells
33192
Number Of Labs/clbs
3688
Total Ram Bits
663552
Number Of I /o
304
Number Of Gates
1600000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
400-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
HW-XA3S1600E-UNI-G - KIT DEVELOPMENT AUTOMOTIVE ECU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC3S1600E-5FGG400C
Manufacturer:
XILINX
Quantity:
259
Company:
Part Number:
XC3S1600E-5FGG400C
Manufacturer:
Xilinx Inc
Quantity:
10 000
Part Number:
XC3S1600E-5FGG400C
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
- Current page: 171 of 233
- Download datasheet (6Mb)
User I/Os by Bank
Table 132
distributed between the four I/O banks on the VQ100 pack-
age.
Table 132: User I/Os Per Bank for XC3S100E, XC3S250E, and XC3S500E in the VQ100 Package
Footprint Migration Differences
The production XC3S100E, XC3S250E, and XC3S500E
FPGAs have identical footprints in the VQ100 package.
Designs can migrate between the devices without further
consideration.
DS312-4 (v3.8) August 26, 2009
Product Specification
Notes:
1.
2.
Top
Right
Bottom
Left
TOTAL
Package
Edge
Some VREF and CLK pins are on INPUT pins.
The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
indicates how the 66 available user-I/O pins are
R
I/O Bank
0
1
2
3
Maximum
I/O
15
15
19
17
66
I/O
16
5
6
0
5
www.xilinx.com
INPUT
0
0
0
1
1
All Possible I/O Pins by Type
DUAL
18
21
1
0
2
VREF
1
1
1
1
4
(1)
Pinout Descriptions
CLK
0
24
8
8
8
(2)
(1)
171
Related parts for XC3S1600E-5FGG400C
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
IC SPARTAN-3E FPGA 1600K 320-FBG
Manufacturer:
Xilinx Inc
Datasheet:
Part Number:
Description:
IC SPARTAN-3E FPGA 1600K 400FBGA
Manufacturer:
Xilinx Inc
Datasheet:
Part Number:
Description:
IC FPGA SPARTAN-3E 1600K 320FBGA
Manufacturer:
Xilinx Inc
Datasheet:
Part Number:
Description:
IC FPGA SPARTAN-3E 1600K 320FBGA
Manufacturer:
Xilinx Inc
Datasheet:
Part Number:
Description:
IC FPGA SPARTAN-3E 1600K 400FBGA
Manufacturer:
Xilinx Inc
Datasheet:
Part Number:
Description:
IC FPGA SPARTAN-3E 1600K 484FBGA
Manufacturer:
Xilinx Inc
Datasheet:
Part Number:
Description:
IC FPGA SPARTAN 3E 320FBGA
Manufacturer:
Xilinx Inc
Datasheet:
Part Number:
Description:
IC FPGA SPARTAN 3E 400FBGA
Manufacturer:
Xilinx Inc
Datasheet:
Part Number:
Description:
IC FPGA SPARTAN 3E 484FBGA
Manufacturer:
Xilinx Inc
Datasheet:
Part Number:
Description:
FPGA, SPARTAN-3E, 1600K GATES, 484FBGA
Manufacturer:
Xilinx Inc
Datasheet:
Part Number:
Description:
PROGRAMMABLE MICROCHIP
Manufacturer:
Xilinx Inc
Datasheet:
Part Number:
Description:
FPGA Spartan®-3E Family 1.6M Gates 33192 Cells 572MHz 90nm (CMOS) Technology 1.2V 484-Pin FBGA
Manufacturer:
Xilinx Inc
Datasheet:
Part Number:
Description:
FPGA Spartan®-3E Family 1.6M Gates 33192 Cells 657MHz 90nm (CMOS) Technology 1.2V 400-Pin FBGA
Manufacturer:
Xilinx Inc
Datasheet:
Part Number:
Description:
FPGA Spartan®-3E Family 1.6M Gates 33192 Cells 572MHz 90nm (CMOS) Technology 1.2V 320-Pin FBGA
Manufacturer:
Xilinx Inc
Datasheet:
Part Number:
Description:
IC CPLD .8K 36MCELL 44-VQFP
Manufacturer:
Xilinx Inc
Datasheet: