XC3S1600E-5FGG400C Xilinx Inc, XC3S1600E-5FGG400C Datasheet - Page 189

• Manufacturer Part Number: XC3S1600E-5FGG400C
• Description: FPGA Spartan®-3E Family 1.6M Gates 33192 Cells 657MHz 90nm (CMOS) Technology 1.2V 400-Pin FBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3Er

Specifications of XC3S1600E-5FGG400C

• Package: 400FBGA
• Family Name: Spartan®-3E
• Device Logic Cells: 33192
• Device Logic Units: 3688
• Device System Gates: 1600000
• Number Of Registers: 29504
• Maximum Internal Frequency: 657 MHz
• Typical Operating Supply Voltage: 1.2 V
• Maximum Number Of User I/os: 304
• Ram Bits: 663552
• Number Of Logic Elements/cells: 33192
• Number Of Labs/clbs: 3688
• Total Ram Bits: 663552
• Number Of I /o: 304
• Number Of Gates: 1600000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 400-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: HW-XA3S1600E-UNI-G - KIT DEVELOPMENT AUTOMOTIVE ECU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

User I/Os by Bank
Table 142
distributed between the four I/O banks on the PQ208 pack-
age.
Table 142: User I/Os Per Bank for the XC3S250E and XC3S500E in the PQ208 Package
DS312-4 (v3.8) August 26, 2009
Product Specification
Notes:
1.
2.
Top
Right
Bottom
Left
TOTAL
Package
Some VREF and CLK pins are on INPUT pins.
The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
Edge
indicates how the 158 available user-I/O pins are
R
I/O Bank
0
1
2
3
Maximum
158
I/O
38
40
40
40
I/O
18
23
58
9
8
www.xilinx.com
Footprint Migration Differences
The XC3S250E and XC3S500E FPGAs have identical foot-
prints in the PQ208 package. Designs can migrate between
the XC3S250E and XC3S500E without further consider-
ation.
INPUT
25
6
7
6
6
All Possible I/O Pins by Type
DUAL
21
24
46
1
0
VREF
13
5
3
2
3
Pinout Descriptions
(1)
CLK
0
0
16
8
8
(2)
(2)
(1)
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