XC3S250E-4PQG208C Xilinx Inc, XC3S250E-4PQG208C Datasheet - Page 168

• Manufacturer Part Number: XC3S250E-4PQG208C
• Description: FPGA Spartan®-3E Family 250K Gates 5508 Cells 572MHz 90nm (CMOS) Technology 1.2V 208-Pin PQFP
• Manufacturer: Xilinx Inc
• Series: Spartan™-3Er

Specifications of XC3S250E-4PQG208C

• Package: 208PQFP
• Family Name: Spartan®-3E
• Device Logic Cells: 5508
• Device Logic Units: 612
• Device System Gates: 250000
• Number Of Registers: 4896
• Maximum Internal Frequency: 572 MHz
• Typical Operating Supply Voltage: 1.2 V
• Maximum Number Of User I/os: 158
• Ram Bits: 221184
• Number Of Logic Elements/cells: 5508
• Number Of Labs/clbs: 612
• Total Ram Bits: 221184
• Number Of I /o: 158
• Number Of Gates: 250000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 208-BFQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1483

Pinout Descriptions
Package Thermal Characteristics
The power dissipated by an FPGA application has implica-
tions on package selection and system design. The power
consumed by a Spartan-3E FPGA is reported using either
the
integrated in the Xilinx ISE® development software.
Table 130
ous Spartan-3E package offerings.
The junction-to-case thermal resistance (θ
difference between the temperature measured on the pack-
Table 130: Spartan-3E Package Thermal Characteristics
168
Package
VQ100
CP132
TQ144
PQ208
FG320
FG400
FG484
FT256
XPower Estimator
provides the thermal characteristics for the vari-
XC3S1200E
XC3S1200E
XC3S1600E
XC3S1600E
XC3S1200E
XC3S1600E
XC3S100E
XC3S250E
XC3S500E
XC3S100E
XC3S250E
XC3S500E
XC3S100E
XC3S250E
XC3S250E
XC3S500E
XC3S250E
XC3S500E
XC3S500E
Device
or the
Junction-to-Case
XPower Analyzer
(θ
13.0
11.0
19.3
11.8
12.4
9.8
8.5
8.2
7.2
9.8
8.5
9.6
6.5
9.8
7.1
7.5
6.0
5.7
8.2
JC
)
JC
) indicates the
calculator
Junction-to-
Board (θ
www.xilinx.com
30.9
25.9
31.9
42.0
28.1
21.3
25.7
29.0
26.8
27.7
22.2
16.4
15.6
12.5
10.6
12.4
10.4
9.4
JB
)
age body (case) and the die junction temperature per watt
of power consumption. The junction-to-board (θ
similarly reports the difference between the board and junc-
tion temperature. The junction-to-ambient (θ
reports the temperature difference per watt between the
ambient environment and the junction temperature. The θ
value is reported at different air velocities, measured in lin-
ear feet per minute (LFM). The “Still Air (0 LFM)” column
shows the θ
resistance drops with increasing air flow.
Still Air
(0 LFM)
49.0
43.3
40.0
62.1
48.3
41.5
52.1
37.6
37.0
36.1
35.8
31.1
26.2
26.1
23.0
21.1
22.3
20.3
18.8
Junction-to-Ambient (θ
JA
at Different Air Flows
250 LFM
value in a system without a fan. The thermal
40.7
36.0
33.3
55.3
41.8
35.2
40.5
29.2
27.3
26.6
29.3
25.0
20.5
20.6
17.7
15.9
17.2
15.2
12.5
500 LFM
37.9
33.6
31.0
52.8
39.5
32.9
34.6
25.0
24.1
23.6
28.4
24.0
19.3
19.4
16.4
14.6
16.0
14.0
11.3
DS312-4 (v3.8) August 26, 2009
JA
750 LFM
)
Product Specification
37.0
32.7
30.2
51.2
38.0
31.5
32.5
23.4
22.4
21.8
28.1
23.6
18.9
18.6
15.7
13.8
15.3
13.3
10.8
JA
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
JB
Units
) value
) value
JA
R