PBSS306PX,115 NXP Semiconductors, PBSS306PX,115 Datasheet - Page 11

• Manufacturer Part Number: PBSS306PX,115
• Description: TRANS PNP 100V 3.7A SOT-89
• Manufacturer: NXP Semiconductors
• Series: -r

Specifications of PBSS306PX,115

• Package / Case: SC-62, SOT-89, TO-243 (3 Leads + Tab)
• Transistor Type: PNP
• Current - Collector (ic) (max): 3.7A
• Voltage - Collector Emitter Breakdown (max): 100V
• Vce Saturation (max) @ Ib, Ic: 300mV @ 400mA, 4A
• Dc Current Gain (hfe) (min) @ Ic, Vce: 100 @ 2A, 2V
• Power - Max: 2.1W
• Frequency - Transition: 100MHz
• Mounting Type: Surface Mount
• Minimum Operating Temperature: - 65 C
• Configuration: Single
• Transistor Polarity: PNP
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: 100 V
• Emitter- Base Voltage Vebo: 5 V
• Maximum Dc Collector Current: 3.7 A
• Power Dissipation: 2100 mW
• Maximum Operating Frequency: 100 MHz
• Maximum Operating Temperature: + 150 C
• Current - Collector Cutoff (max): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Collector Cutoff (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 934059019115; PBSS306PX T/R; PBSS306PX T/R

NXP Semiconductors
11. Soldering
PBSS306PX_2
Product data sheet
Fig 16. Reflow soldering footprint
Fig 17. Wave soldering footprint
4.60
0.85
SOT89 standard mounting conditions for reflow soldering
Not recommended for wave soldering
1.20
1.20
1.00
0.20
(3x)
1.50
3
Rev. 02 — 11 December 2009
6.60
2.40
0.70
5.30
3
3.70
1.90
1.20
3.95
4.75
2.25
2.00
2
1
2
0.50
100 V, 3.7 A PNP low V
1.20
3.50
3.00
1
0.60 (3x)
0.70 (3x)
7.60
0.50
preferred transport direction during soldering
1.20
1.70
4.85
Dimensions in mm
msa442
PBSS306PX
CEsat
solder lands
solder resist
occupied area
Dimensions in mm
© NXP B.V. 2009. All rights reserved.
(BISS) transistor
solder lands
solder resist
occupied area
solder paste
msa423
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