MT48LC4M32B2B5-7 IT:G Micron Technology Inc, MT48LC4M32B2B5-7 IT:G Datasheet - Page 38
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MT48LC4M32B2B5-7 IT:G
Manufacturer Part Number
MT48LC4M32B2B5-7 IT:G
Description
DRAM Chip SDRAM 128M-Bit 4Mx32 3.3V 90-Pin VFBGA Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet
1.MT48LC4M32B2P-7G_TR.pdf
(67 pages)
Specifications of MT48LC4M32B2B5-7 IT:G
Density
128 Mb
Maximum Clock Rate
143 MHz
Package
90VFBGA
Address Bus Width
14 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
17|8|5.5 ns
Operating Temperature
-40 to 85 °C
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
128M (4Mx32)
Speed
143MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Package / Case
90-VFBGA
Organization
4Mx32
Address Bus
14b
Access Time (max)
17/8/5.5ns
Operating Supply Voltage (typ)
3.3V
Package Type
VFBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
175mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Table 10:
PDF: 09005aef80872800/Source: 09005aef80863355
128MbSDRAMx32_2.fm - Rev. L 1/09 EN
Write (auto
Row active
Read (auto
precharge
precharge
disabled)
disabled)
Current
State
Any
Idle
Truth Table – Current State Bank n, Command To Bank n
Notes 1–6 apply to the entire table
CS#
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
Notes:
RAS#
X
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
1. This table applies when CKE
2. This table is bank-specific, except where noted; i.e., the current state is for a specific bank
3. Current state definitions:
4. The following states must not be interrupted by a command issued to the same bank. COM-
after
and the commands shown are those allowed to be issued to that bank when in that state.
Exceptions are covered in the notes below.
MAND INHIBIT or NOP commands, or allowable commands to the other bank should be
issued on any clock edge occurring during these states. Allowable commands to the other
bank are determined by its current state and Table 10, and according to Table 11 on
page 40.
CAS#
Row active: A row in the bank has been activated, and
precharge enabled:
precharge enabled:
X
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
L
t
XSR has been met (if the previous state was self refresh).
Row activating: Starts with registration of an ACTIVE command and ends when
Write: A WRITE burst has been initiated, with auto precharge disabled, and has not
Read: A READ burst has been initiated, with auto precharge disabled, and has not
Write w/auto
Idle: The bank has been precharged, and
Precharging: Starts with registration of a PRECHARGE command and ends when
Read w/auto
WE#
H
H
H
H
H
H
X
L
L
L
L
L
L
L
L
L
L
bursts/accesses and no register accesses are in progress.
yet terminated or been terminated.
yet terminated or been terminated.
COMMAND (ACTION)
WRITE (Select column and start WRITE burst)
PRECHARGE (Truncate READ burst, start precharge)
BURST TERMINATE
READ (Select column and start READ burst)
WRITE (Select column and start new WRITE burst)
PRECHARGE (Truncate WRITE burst, start precharge)
BURST TERMINATE
COMMAND INHIBIT (NOP/Continue previous operation)
NO OPERATION (NOP/Continue previous operation)
ACTIVE (Select and activate row)
AUTO REFRESH
LOAD MODE REGISTER
PRECHARGE
READ (Select column and start READ burst)
WRITE (Select column and start WRITE burst)
PRECHARGE (Deactivate row in bank or banks)
READ (Select column and start new READ burst)
t
is met. Once
Starts with registration of a READ command with auto precharge
enabled and ends when
will be in the idle state.
enabled and ends when
will be in the idle state.
RP is met. Once
Starts with registration of a WRITE command with auto precharge
n-1
38
was HIGH and CKE
t
RCD is met, the bank will be in the row active state.
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t
RP is met, the bank will be in the idle state.
t
t
RP has been met. Once
RP has been met. Once
n
t
is HIGH (see Table 9 on page 37) and
RP has been met.
t
RCD has been met. No data
©2001 Micron Technology, Inc. All rights reserved.
128Mb: x32 SDRAM
Register Definition
t
t
RP is met, the bank
RP is met, the bank
Notes
11
10
10
10
10
10
10
7
7
8
8
8
9
t
RCD