5536603-1 TE Connectivity, 5536603-1 Datasheet - Page 25

Conn Backplane HDR 8Power POS 2mm Press Fit ST Thru-Hole

5536603-1

Manufacturer Part Number
5536603-1
Description
Conn Backplane HDR 8Power POS 2mm Press Fit ST Thru-Hole
Manufacturer
TE Connectivity
Type
Backplaner
Series
5536603r
Datasheet

Specifications of 5536603-1

Pitch
2 mm
Number Of Rows
4
Number Of Contacts
8Power
Termination Method
Press Fit
Mounting
Through Hole
Contact Plating
Gold Over Nickel|Gold Over Palladium Nickel Over Nickel
Rohs Compliant
YES
Number Of Positions / Contacts
8
Mounting Angle
Vertical
Mounting Style
Press Fit
Termination Style
Pin
Housing Material
Liquid Crystal Polymer
Contact Material
Phosphor Bronze
Product Type
Connector
Connector Type
Header
Pcb Mounting Orientation
Vertical
Post Type
Press-Fit
Make First / Break Last
No
Module Type
Power
Number Of Power Positions
8
Pin Header Width (mm [in])
16.00 [0.622]
Voltage Rating (vac)
30
Sequencing
Yes
Sequencing Configuration Row A
Mating Post Length 6.5mm, Termination Post Length 4.25mm
Sequencing Configuration Row B
Mating Post Length 6.5mm, Termination Post Length 4.25mm
Sequencing Configuration Row C
Mating Post Length 6.5mm, Termination Post Length 4.25mm
Sequencing Configuration Row D
Mating Post Length 6.5mm, Termination Post Length 4.25mm
Post Plating
Tin
Centerline, Matrix (mm [in])
2.00 x 2.00 [.079 x .079]
Contact Type
Pin
Contact Base Material
Phosphor Bronze
Contact Plating, Mating Area, Material
Gold (30)
Connector Style
Plug
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Not relevant for lead free process
Rohs/elv Compliance History
Always was RoHS compliant
Applies To
Printed Circuit Board
Application
Fixed-Board
Lead Free Status / Rohs Status
 Details
34
Product Facts
Applications
Technical Documents
Product Specification
108-2325
Application Specification
114-13215
Catalog 1773096
Revised 2-10
www.tycoelectronics.com
High-density, low profile,
power/signal, blind-mate
connector
Developed to meet next
generation 1U application
by reducing airflow
impedance
Design is customizable
Serves both solder reflow
and press-fit applications
with the same contact
1U Servers
High End Servers
Telecommunications
Switches, requiring low
profile
Hot-pluggable power
supplies
70
60
50
40
30
20
10
0
0
NEW
Current DC Amperes
10
Temperature Rise Vs Current
Temperature Rise Chart
8 Circuits 2 oz 2 Layer
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
MINIPAK HDL
20
Power Connectors & Interconnection Systems
“NEW” MINIPAK HDL Connectors
Tyco Electronics’ new
MINIPAK HDL connector
combines a high-density
power interface into a blind-
mateable board-to-board
connector, which stands
only 8 mm off the edge of
the printed circuit board.
The MINIPAK HDL product
consists of a right-angle
plug and right-angle recep-
tacle, which utilizes an eye
of the needle tail that can
be used in both solder
and press-fit applications.
The contact offers a current
rating of 16 amps, low con-
tact resistance, and mating
forces less than 0.3 pounds
per contact.
30
0 FPM
100 FPM
200 FPM
300 FPM
Power (0 FPM)
Power (100 FPM)
Power (200 FPM)
Power (300 FPM)
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
The connector is designed
and manufactured to be
mass-customizable, allow-
ing the customer to select a
wide array of configurations
and layouts. MINIPAK HDL
connectors also contain
three levels of mating
sequences. This product is
designed specifically for
modular hot-swappable
power distribution systems.
The MINIPAK HDL connector
offers 20% more current
density in a smaller package
than other products cur-
rently offered in the market.
MINIPAK HDL
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
Connector
MULTIBEAM XL
Connector
Simulated Side View of 1U Chassis
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-(0)8002-67666
[.315]
8.00
12.60
[.496]
Airflow

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