5536603-1 TE Connectivity, 5536603-1 Datasheet - Page 36

• Manufacturer Part Number: 5536603-1
• Description: Conn Backplane HDR 8Power POS 2mm Press Fit ST Thru-Hole
• Manufacturer: TE Connectivity
• Type: Backplaner
• Series: 5536603r

Specifications of 5536603-1

• Pitch: 2 mm
• Number Of Rows: 4
• Number Of Contacts: 8Power
• Termination Method: Press Fit
• Mounting: Through Hole
• Contact Plating: Gold Over Nickel|Gold Over Palladium Nickel Over Nickel
• Rohs Compliant: YES
• Number Of Positions / Contacts: 8
• Mounting Angle: Vertical
• Mounting Style: Press Fit
• Termination Style: Pin
• Housing Material: Liquid Crystal Polymer
• Contact Material: Phosphor Bronze
• Product Type: Connector
• Connector Type: Header
• Pcb Mounting Orientation: Vertical
• Post Type: Press-Fit
• Make First / Break Last: No
• Module Type: Power
• Number Of Power Positions: 8
• Pin Header Width (mm [in]): 16.00 [0.622]
• Voltage Rating (vac): 30
• Sequencing: Yes
• Sequencing Configuration Row A: Mating Post Length 6.5mm, Termination Post Length 4.25mm
• Sequencing Configuration Row B: Mating Post Length 6.5mm, Termination Post Length 4.25mm
• Sequencing Configuration Row C: Mating Post Length 6.5mm, Termination Post Length 4.25mm
• Sequencing Configuration Row D: Mating Post Length 6.5mm, Termination Post Length 4.25mm
• Post Plating: Tin
• Centerline, Matrix (mm [in]): 2.00 x 2.00 [.079 x .079]
• Contact Type: Pin
• Contact Base Material: Phosphor Bronze
• Contact Plating, Mating Area, Material: Gold (30)
• Connector Style: Plug
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Applies To: Printed Circuit Board
• Application: Fixed-Board
• Lead Free Status / Rohs Status: Details

Product Facts
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Typical Applications
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Catalog 1773096
Revised 2-10
www.tycoelectronics.com
Uses high-performance
Crown contact
35A current rating
True compliant press-fit and
solder tails
Pin locking feature option
Standard DIP footprint
.300 x .100 and
ICCON SLIMLINE connector
.100 x .100
Insulator rated at 105°C,
UL 94V-0
Meets safety regulatory
requirements
#8 AWG wire size
Parallel and perpendicular
Sequencing capability
All ICCON products in
this section are RoHS
compliant
Power distribution
Board-to-board
interconnection
Board-to-busbar
interconnection
Board-to-wire
interconnection
High-density power designs
Board stacking
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Power Connectors & Interconnection Systems
ICCON Single Pole Power Connectors
ICCON connectors provide
a reliable high current
power interconnection with
quick connect/disconnect
function for space
constrained motherboard-
daughterboard, cable-
board and board-busbar
power delivery applications.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Product Highlights
High Performance Contact
ICCON connectors use
ELCON CROWN BAND
Contact, a multifingered
spring which provides a
greater surface contact
area, thus ensuring small
millivolt drop, minimum heat
generation and very low
insertion and extraction
forces.
Optional Locking Feature
The optional locking feature
provides minimum 5 lbs.
(2.21kg) retention force
to improve connection
integrity, securing against
accidental unmating in
harsh mechanical
conditions.
Support for Multiple Mounting
Styles
ICCON connectors are
available with press-fit or
solder tails for mounting
on both PC boards and bus
bars. Tyco Electronics uses
eye of the needle true
compliant tails for the most
reliable mounting using
solderless techniques.
Each ICCON connector has
a 10 pin DIP footprint for
convenient industry stan-
dard mounting. Through
hole socket connectors can
be used in “bottom entry”
applications.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
Mating with Discrete Contracts
For further versatility,
ICCON connector products
can mate with discrete
contacts, available in a
variety of termination types.
ICCON SLIMLINE Connectors
With a footprint close to
30% smaller than the
standard ICCON connector
products, the ICCON
SLIMLINE connector
products allow integrating
more components in less
board real estate, providing
substantial space savings
compared to connectors of
this type in the same
performance range.
Stacked ICCON
Designed for motherboard-
to-daughtercard power
distribution systems, the
Stacked ICCON combined
power/guide module
occupies significantly less
PCB edge space than
separate modules.
Providing more than 200
Amps/inch, this right-angle
mounted connector is ideal
for applications needing
high current density.
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-(0)8002-67666
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