5536603-1 TE Connectivity, 5536603-1 Datasheet - Page 47

Conn Backplane HDR 8Power POS 2mm Press Fit ST Thru-Hole

5536603-1

Manufacturer Part Number
5536603-1
Description
Conn Backplane HDR 8Power POS 2mm Press Fit ST Thru-Hole
Manufacturer
TE Connectivity
Type
Backplaner
Series
5536603r
Datasheet

Specifications of 5536603-1

Pitch
2 mm
Number Of Rows
4
Number Of Contacts
8Power
Termination Method
Press Fit
Mounting
Through Hole
Contact Plating
Gold Over Nickel|Gold Over Palladium Nickel Over Nickel
Rohs Compliant
YES
Number Of Positions / Contacts
8
Mounting Angle
Vertical
Mounting Style
Press Fit
Termination Style
Pin
Housing Material
Liquid Crystal Polymer
Contact Material
Phosphor Bronze
Product Type
Connector
Connector Type
Header
Pcb Mounting Orientation
Vertical
Post Type
Press-Fit
Make First / Break Last
No
Module Type
Power
Number Of Power Positions
8
Pin Header Width (mm [in])
16.00 [0.622]
Voltage Rating (vac)
30
Sequencing
Yes
Sequencing Configuration Row A
Mating Post Length 6.5mm, Termination Post Length 4.25mm
Sequencing Configuration Row B
Mating Post Length 6.5mm, Termination Post Length 4.25mm
Sequencing Configuration Row C
Mating Post Length 6.5mm, Termination Post Length 4.25mm
Sequencing Configuration Row D
Mating Post Length 6.5mm, Termination Post Length 4.25mm
Post Plating
Tin
Centerline, Matrix (mm [in])
2.00 x 2.00 [.079 x .079]
Contact Type
Pin
Contact Base Material
Phosphor Bronze
Contact Plating, Mating Area, Material
Gold (30)
Connector Style
Plug
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Not relevant for lead free process
Rohs/elv Compliance History
Always was RoHS compliant
Applies To
Printed Circuit Board
Application
Fixed-Board
Lead Free Status / Rohs Status
 Details
56
Vertical Pin Assemblies
with Solder Leads and
Compliant Press-Fit Leads
Material and Finish
Housing — Liquid crystal polymer
Pin Contacts — Phosphor bronze,
mating surface plating conforms to
all testing specified for Telcordia
Uncontrolled Environment, with entire
contact underplated with 0.00127 min.
nickel. See customer drawing for spe-
cific lead plating.
Related Product Data
Current Rating — 5 Amps per contact
Mating Force — 2.4N per contact
max.
Unmating Force — 0.3N per contact
max.
Durability — 250 cycles
Technical Documents
Product Specification
108-1441
Application Specification
114-1075
Instruction Sheets
408-6927, 408-4157, 408-4488
Catalog 1773096
Revised 2-10
www.tycoelectronics.com
3 Spaces at
2.00 = 6.00
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
1
Dimensions apply to solder lead versions only.
Recommended PC Board Hole Layout
per IPC-D-300, Type II, Class C
Power Connectors & Interconnection Systems
Z-PACK 2 mm Futurebus+ Power Modules
Reference specification 114-1075 for plated through hole requirements.
Note: All part numbers are RoHS compliant.
Number of
17.00
Positions
(Component Side)
11.83
10
Length
8
10.00
Lead
4.25
15.80
Mating Post
Solder Leads
.256 [6.50]
.285 [7.25]
.315 [8.00]
.256 [6.50]
.315 [8.00]
Lengths
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
A B C D
11.50
Rows
4 Row
3 Spaces at
2.00 = 6.00
Post Length
Solder Lead
(See Chart
4.00
5536600-1
5536625-1
5536623-1
1.50
Dia. Typ.
(Drilled Hole)
Below.)
Mating
12.00
1
4.25
+0.10
-0.00
13.60
1
1
4 Spaces at
2.00 = 8.00
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
Solder Lead
5536628-1
1
Dimensions apply to solder lead versions only.
3.2
Recommended PC Board Hole Layout
Lead Length
per IPC-D-300, Type II, Class C
Part Numbers
4.25
11.88
3.40
5536603-1
5536620-1
5536642-1
5536642-7
(Component Side)
Press-Fit
17.80
10.00
A B C D E
Solder Leads
Rows
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-(0)8002-67666
13.50
536565-X
223041-X
5 Row
Housing
Shroud
4 Spaces at
2.00 = 8.00
Length (See
chart below)
Mating Post
1214224-1
58512-1
Seating
Tooling
13.60
1.50
Dia. Typ.
(Drilled Hole)
4.00
14.00
1
+0.10
-0.00
1
1

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