5536603-1 TE Connectivity, 5536603-1 Datasheet - Page 51

• Manufacturer Part Number: 5536603-1
• Description: Conn Backplane HDR 8Power POS 2mm Press Fit ST Thru-Hole
• Manufacturer: TE Connectivity
• Type: Backplaner
• Series: 5536603r

Specifications of 5536603-1

• Pitch: 2 mm
• Number Of Rows: 4
• Number Of Contacts: 8Power
• Termination Method: Press Fit
• Mounting: Through Hole
• Contact Plating: Gold Over Nickel|Gold Over Palladium Nickel Over Nickel
• Rohs Compliant: YES
• Number Of Positions / Contacts: 8
• Mounting Angle: Vertical
• Mounting Style: Press Fit
• Termination Style: Pin
• Housing Material: Liquid Crystal Polymer
• Contact Material: Phosphor Bronze
• Product Type: Connector
• Connector Type: Header
• Pcb Mounting Orientation: Vertical
• Post Type: Press-Fit
• Make First / Break Last: No
• Module Type: Power
• Number Of Power Positions: 8
• Pin Header Width (mm [in]): 16.00 [0.622]
• Voltage Rating (vac): 30
• Sequencing: Yes
• Sequencing Configuration Row A: Mating Post Length 6.5mm, Termination Post Length 4.25mm
• Sequencing Configuration Row B: Mating Post Length 6.5mm, Termination Post Length 4.25mm
• Sequencing Configuration Row C: Mating Post Length 6.5mm, Termination Post Length 4.25mm
• Sequencing Configuration Row D: Mating Post Length 6.5mm, Termination Post Length 4.25mm
• Post Plating: Tin
• Centerline, Matrix (mm [in]): 2.00 x 2.00 [.079 x .079]
• Contact Type: Pin
• Contact Base Material: Phosphor Bronze
• Contact Plating, Mating Area, Material: Gold (30)
• Connector Style: Plug
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Applies To: Printed Circuit Board
• Application: Fixed-Board
• Lead Free Status / Rohs Status: Details

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Product Facts
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Technical Documents
Product Specification
108-2216
Application Specification
114-13156
Industry Standard
PICMG 3.0, Rev. 2.0
AdvancedTCA and PICMG are
trademarks of the PICMG-PCI Industrial
Computer Manufacturers Group, Inc.
Catalog 1773096
Revised 2-10
www.tycoelectronics.com
Designed to PICMG 3.0
Standard
High conductivity copper
alloy on Size 16 power
contacts
.76 micro-meters
[30 microinch] gold over
1.27 micrometers
[50 microinch] nickel
plating at contact interface
Gold-thickness controlled on
inside of socket and outside
of pin — at contact interface
points
RoHS compliant
Stainless steel spring
provides contact normal
force — resists relaxation at
elevated temperatures
Eye of the needle compliant
press-fit termination
No special tools needed to
seat connectors to PCB —
standard Flat-Rock seating
tools
Additional PCB retention
hardware not required
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Power Connectors & Interconnection Systems
Z1 Power Connector for AdvancedTCA Zone 1 Applications
Introduction
Tyco Electronics supplies
both the power and the
signal connectors
specified in the Advanced
Telecommunications
Computer Architecture
(AdvancedTCA) Standard.
This standard (PICMG 3.0)
is one of the latest stan-
dards addressing future
telecommunications needs.
The AdvancedTCA Power
Connector, designated for
use in Zone 1 per PICMG
3.0, combines 8 High
Conductivity Size 16 pin &
socket contacts along with
22 Size 22 pin & socket
contacts, plus guidance
into a compact interface.
Both connector halves
feature proven compliant
press-fit contacts for easy
solder-less termination to
printed circuit boards.
Based on years of reliable
long-term field installations
the power contact design is
based upon Tyco Electronics’
famous Type III+ contact
design. By adding the use
of a high conductivity cop-
per alloy and the low-force
Eye-Of-Needle compliant
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
pin section, the new con-
tact delivers both ease of
installation (with flat-rock
seating tools) as well as
industry-leading current
carrying capability. The
power contacts are capable
of carrying 20 amps per
contact and the signals are
capable of carrying 2 amps
per contact.
The housing design also
offers improvements com-
pared to other industry
alternatives. The lead-in
design for the contact
cavities provides better
resistance from contact
stubbing. The contact
retention has also been
designed to eliminate the
need for additional hard-
ware sometimes used to
hold the connectors to
the PCB after pressing in to
the PCB.
The result is a connector
which is easy to install,
meets all the PICMG 3.0
performance requirements
and stays retained to the
PCB without the additional
labor required to add
hardware.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
Typical Electrical Properties
Current Ratings — tested in
accordance with CSA C22.2 No.
182.3-M1987 and IEC 60512-3, Test 5a
requirements:
Positions 1–24, 27, 32 — 1 Amp each,
per the PICMG 3.0 Specification
Positions 25, 26, 28–31, and 34 —
20 Amps each, exceeds the PICMG 3.0
Specification
Dielectric Withstanding Voltage —
Positions 1–16 — 1000 Volts rms
Positions 17–24 — 2000 Volts rms
Positions 25–34 — 2000 Volts rms
Environmental Parameters
Maximum Continuous Operating
Temperature — 105°C
Durability Rating — 250 cycles, per
PICMG 3.0
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-(0)8002-67666
METRIC
millimeters over inches
Dimensions are