BDN11-3CB/A01 CTS Thermal Management Products

HEATSINK CPU W/ADHESIVE 1.11"SQ

BDN11-3CB/A01

Manufacturer Part Number

BDN11-3CB/A01

Description

HEATSINK CPU W/ADHESIVE 1.11"SQ

Manufacturer

CTS Thermal Management Products

Series

BDNr

Specifications of BDN11-3CB/A01

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Attachment Method

Thermal Tape, Adhesive (Included)

Outline

28.19mm x 28.19mm

Height

0.35" (9mm)

Thermal Resistance @ Forced Air Flow

7.2°C/W @ 400 LFM

Thermal Resistance @ Natural

20.9°C/W

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Power Dissipation @ Temperature Rise

-

Other names

294-1109
BDN113CBA01

Related parts for BDN11-3CB/A01

Related keywords

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