BDN12-5CB/A01 CTS Thermal Management Products

HEATSINK CPU W/ADHESIVE 1.21"SQ

BDN12-5CB/A01

Manufacturer Part Number
BDN12-5CB/A01
Description
HEATSINK CPU W/ADHESIVE 1.21"SQ
Manufacturer
CTS Thermal Management Products
Series
BDNr

Specifications of BDN12-5CB/A01

Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Outline
30.73mm x 30.73mm
Height
0.550" (14.00mm)
Thermal Resistance @ Forced Air Flow
5.2°C/W @ 400 LFM
Thermal Resistance @ Natural
16.5°C/W
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation @ Temperature Rise
-
Other names
294-1110
BDN125CBA01

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