PX1011B-EL1/N NXP Semiconductors, PX1011B-EL1/N Datasheet - Page 3

• Manufacturer Part Number: PX1011B-EL1/N
• Manufacturer: NXP Semiconductors

Specifications of PX1011B-EL1/N

• Lead Free Status / RoHS Status: Not Compliant

NXP Semiconductors
4. Ordering information
Table 2.
5. Marking
PX1011B_4
Product data sheet
Type number
PX1011B-EL1/G
PX1011B-EL1/N
PX1011BI-EL1/G Pb-free (SnAgCu
Ordering information
Solder process
Pb-free (SnAgCu
solder ball compound)
SnPb solder ball
compound
solder ball compound)
Table 3.
Table 4.
[1]
Line
A
B
C
Line
A
B
C
Industrial temperature range.
Marking
PX1011B-EL1/N
xxxxxxx
2PNyyww
Marking
PX1011B-EL1/G
PX1011BI-EL1/G
xxxxxxx
2PGyyww
Leaded package marking
Lead-free package marking
Package
Name
LFBGA81
LFBGA81
LFBGA81
Rev. 04 — 4 September 2009
[1]
Description
full basic type number
diffusion lot number
manufacturing code:
Description
full basic type number
diffusion lot number
manufacturing code:
Description
plastic low profile fine-pitch ball grid array package;
81 balls; body 9
plastic low profile fine-pitch ball grid array package;
81 balls; body 9
plastic low profile fine-pitch ball grid array package;
81 balls; body 9
2 = diffusion site
P = assembly site
N = leaded
yy = year code
ww = week code
2 = diffusion site
P = assembly site
G = lead-free
yy = year code
ww = week code
9
9
9
1.05 mm
1.05 mm
1.05 mm
PCI Express stand-alone X1 PHY
PX1011B
© NXP B.V. 2009. All rights reserved.
Version
SOT643-1
SOT643-1
SOT643-1
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