PIC16F1823-I/SL Microchip Technology, PIC16F1823-I/SL Datasheet - Page 266
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC16F1823-I/SL
Manufacturer Part Number
PIC16F1823-I/SL
Description
3.5 KB Flash, 128 Bytes RAM, 32 MHz Int. Osc, 12 I/0, Enhanced Mid Range Core 14
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.PIC16F722-ISS.pdf
(8 pages)
2.PIC12F1822T-ISN.pdf
(404 pages)
3.PIC12F1822T-ISN.pdf
(10 pages)
Specifications of PIC16F1823-I/SL
Core Processor
PIC
Core Size
8-Bit
Speed
32MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Core
PIC
Processor Series
PIC16F
Data Bus Width
8 bit
Maximum Clock Frequency
32 MHz
Data Ram Size
128 B
On-chip Adc
Yes
Number Of Programmable I/os
12
Number Of Timers
3
Operating Supply Voltage
2.3 V to 5.5 V
Operating Temperature Range
- 40 C to + 85 C
A/d Bit Size
10 bit
A/d Channels Available
8
Height
1.25 mm
Interface Type
I2C, SPI, USART
Length
8.65 mm
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.3 V
Width
3.9 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F1823-I/SL
Manufacturer:
MICROCHIP
Quantity:
30 000
Part Number:
PIC16F1823-I/SL
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- Current page: 266 of 404
- Download datasheet (4Mb)
PIC12F/LF1822/PIC16F/LF1823
25.6.5
A Repeated Start condition occurs when the RSEN bit
of the SSP1CON2 register is programmed high and the
Master state machine is no longer active. When the
RSEN bit is set, the SCL pin is asserted low. When the
SCL pin is sampled low, the Baud Rate Generator is
loaded and begins counting. The SDA pin is released
(brought high) for one Baud Rate Generator count
(T
SDA is sampled high, the SCL pin will be deasserted
(brought high). When SCL is sampled high, the Baud
Rate Generator is reloaded and begins counting. SDA
and SCL must be sampled high for one T
action is then followed by assertion of the SDA pin
(SDA = 0) for one T
asserted low. Following this, the RSEN bit of the
FIGURE 25-27:
DS41413B-page 266
BRG
). When the Baud Rate Generator times out, if
I
START CONDITION TIMING
2
C MASTER MODE REPEATED
BRG
REPEAT START CONDITION WAVEFORM
SDA
SCL
while SCL is high. SCL is
Write to SSP1CON2
occurs here
SDA = 1,
SCL (no change)
BRG
. This
Preliminary
T
BRG
SDA = 1,
SCL = 1
T
BRG
Repeated Start
SSP1CON2 register will be automatically cleared and
the Baud Rate Generator will not be reloaded, leaving
the SDA pin held low. As soon as a Start condition is
detected on the SDA and SCL pins, the S bit of the
SSP1STAT register will be set. The SSP1IF bit will not
be set until the Baud Rate Generator has timed out.
Sr
Note 1: If RSEN is programmed while any other
T
BRG
2: A bus collision during the Repeated Start
S bit set by hardware
At completion of Start bit,
hardware clears RSEN bit
Write to SSP1BUF occurs here
event is in progress, it will not take effect.
condition occurs if:
and sets SSP1IF
• SDA is sampled low when SCL
• SCL goes low before SDA is
T
BRG
goes from low-to-high.
asserted low. This may indicate
that another master is attempting to
transmit a data ‘1’.
1st bit
T
BRG
2010 Microchip Technology Inc.
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