PIC18LF25K22-E/SP Microchip Technology, PIC18LF25K22-E/SP Datasheet - Page 220
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PIC18LF25K22-E/SP
Manufacturer Part Number
PIC18LF25K22-E/SP
Description
32KB, Flash, 1536bytes-RAM,8-bit Family,nanoWatt XLP 28 SPDIP .300in TUBE
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Specifications of PIC18LF25K22-E/SP
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 19x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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PIC18(L)F2X/4XK22
15.4
All MSSPx I
shifted out MSb first. Six SFR registers and 2 interrupt
flags interface the module with the PIC
troller and user software. Two pins, SDAx and SCLx,
are exercised by the module to communicate with
other external I
15.4.1 BYTE FORMAT
All communication in I
byte is sent from a master to a slave or vice-versa,
followed by an Acknowledge bit sent back. After the
8th falling edge of the SCLx line, the device outputting
data on the SDAx changes that pin to an input and
reads in an acknowledge value on the next clock
pulse.
The clock signal, SCLx, is provided by the master.
Data is valid to change while the SCLx signal is low,
and sampled on the rising edge of the clock. Changes
on the SDAx line while the SCLx line is high define
special conditions on the bus, explained below.
15.4.2 DEFINITION OF I
There is language and terminology in the description
of I
I
used in the rest of this document without explana-
tion.
specification.
15.4.3 SDAx AND SCLx PINS
Selection of any I
forces the SCLx and SDAx pins to be open-drain.
These pins should be set by the user to inputs by
setting the appropriate TRIS bits.
15.4.4 SDAx HOLD TIME
The hold time of the SDAx pin is selected by the
SDAHT bit of the SSPxCON3 register. Hold time is the
time SDAx is held valid after the falling edge of SCLx.
Setting the SDAHT bit selects a longer 300 ns mini-
mum hold time and may help on buses with large
capacitance.
DS41412D-page 220
2
C. That word usage is defined below and may be
Note: Data is tied to output zero when an I
2
C communication that have definitions specific to
This table was adapted from the Phillips I
I
2
mode is enabled.
C Mode Operation
2
C communication is byte oriented and
2
C devices.
2
C mode with the SSPxEN bit set,
2
C is done in 9-bit segments. A
2
C TERMINOLOGY
®
microcon-
Preliminary
2
2
C
C
TABLE 15-2:
Transmitter
Receiver
Master
Slave
Multi-master
Arbitration
Synchronization Procedure to synchronize the
Idle
Active
Addressed
Slave
Matching
Address
Write Request
Read Request
Clock Stretching When a device on the bus holds
Bus Collision
TERM
I
2
The device which shifts data in
Master sends an address byte with
The device which shifts data out
onto the bus.
from the bus.
The device that initiates a transfer,
generates clock signals and termi-
nates a transfer.
The device addressed by the mas-
ter.
A bus with more than one device
that can initiate data transfers.
Procedure to ensure that only one
master at a time controls the bus.
Winning arbitration ensures that
the message is not corrupted.
clocks of two or more devices on
the bus.
No master is controlling the bus,
and both SDAx and SCLx lines are
high.
Any time one or more master
devices are controlling the bus.
Slave device that has received a
matching address and is actively
being clocked by a master.
Address byte that is clocked into a
slave that matches the value
stored in SSPxADD.
Slave receives a matching
address with R/W bit clear, and is
ready to clock in data.
the R/W bit set, indicating that it
wishes to clock data out of the
Slave. This data is the next and all
following bytes until a Restart or
Stop.
SCLx low to stall communication.
Any time the SDAx line is sampled
low by the module while it is out-
putting and expected high state.
C™ BUS TERMS
2010 Microchip Technology Inc.
Description
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