TZA3033T/C3,112 NXP Semiconductors, TZA3033T/C3,112 Datasheet - Page 4

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TZA3033T/C3,112

Manufacturer Part Number
TZA3033T/C3,112
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TZA3033T/C3,112

Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Lead Free Status / RoHS Status
Compliant
Philips Semiconductors
PINNING
Note
1. For the TZA3033U/G this pad is connected to the gold layer on top of the passivation layer.
2002 Sep 06
DREF
TESTA
GND
IPhoto
TESTB
GND
GND
OUT
OUTQ
V
AGC
SYMBOL
CC
SDH/SONET STM1/OC3
transimpedance amplifier
TZA3033T
PIN
1
2
3
4
5
6
7
8
TZA3033U
13, 14
9, 10
PAD
3, 4
7, 8
11
12
15
1
2
5
6
handbook, halfpage
analog output
ground
analog input
ground
ground
output
output
supply
input/output
TYPE
IPhoto
DREF
GND
GND
Fig.2 Pin configuration.
1
2
3
4
TZA3033T
bias voltage for PIN diode; cathode should be connected to
this pin; note 1
for test purposes only; to be left open in application
ground
current input; anode of PIN diode should be connected to this
pin; DC bias voltage is 1048 mV
for test purposes only; to be left open in application
ground
ground
data output; pin OUT goes HIGH when current flows into
pin IPhoto
data output; compliment of pin OUT
supply voltage
AGC analog I/O
4
MGR369
7
6
5
8
V CC
OUT
GND
OUTQ
DESCRIPTION
Product specification
TZA3033

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