TZA3023T NXP Semiconductors, TZA3023T Datasheet - Page 19
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TZA3023T
Manufacturer Part Number
TZA3023T
Description
Manufacturer
NXP Semiconductors
Datasheet
1.TZA3023T.pdf
(28 pages)
Specifications of TZA3023T
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Lead Free Status / RoHS Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TZA3023T
Manufacturer:
TAIYO
Quantity:
60 000
Part Number:
TZA3023T
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Philips Semiconductors
BONDING PAD LOCATIONS
Note
1. All coordinates are referenced, in m, to the bottom
2002 Sep 05
DREF
GND
GND
IPhoto
GND
GND
GND
GND
OUT
OUTQ
V
V
AGC
handbook, full pagewidth
SYMBOL
CC
CC
SDH/SONET STM4/OC12
transimpedance amplifier
left-hand corner of the die.
PAD
10
11
12
13
1
2
3
4
5
6
7
8
9
Fig.23 Bonding pad plus gold plate locations of the TZA3023U/G.
COORDINATES
215
360
549
691
785
785
567
424
259
1300
95
95
95
95
x
m
IPhoto
DREF
GND
GND
x
0
y
0
1
2
3
4
1055
1055
1055
881
618
473
285
501
641
95
95
95
95
y
(1)
5
13
TZA3023U/G
455 m
6
19
1030 m
12
7
11
1300
Fig.22 Bonding pad locations of the TZA3023U.
m
IPhoto
DREF
8
x
GND
GND
0
10
y
9
0
2
4
1
3
OUTQ
OUT
MCE067
5
13
TZA3023U
725
6
m
12
1030
m
7
11
Product specification
8
10
TZA3023
9
OUTQ
OUT
MCD897