TZA3023T NXP Semiconductors, TZA3023T Datasheet - Page 8

• Manufacturer Part Number: TZA3023T
• Manufacturer: NXP Semiconductors

Specifications of TZA3023T

• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Not Compliant

Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
HANDLING
Precautions should be taken to avoid damage through electrostatic discharge. This is particularly important during
assembly and handling of the bare die. Additional safety can be obtained by bonding the V
remaining pads may then be bonded to their external connections in any order.
THERMAL CHARACTERISTICS
2002 Sep 05
V
V
I
P
T
T
T
R
SYMBOL
n
SYMBOL
stg
j
amb
CC
n
tot
th(j-a)
SDH/SONET STM4/OC12
transimpedance amplifier
supply voltage
DC voltage
DC current
total power dissipation
storage temperature
junction temperature
ambient temperature
thermal resistance from junction to ambient
pin 3/pad 4: IPhoto
pins 6 and 7/pads 9 and 10: OUT and OUTQ
pad 13: AGC (TZA3023U only)
pin 1/pad 1: DREF
pin 3/pad 4: IPhoto
pins 6 and 7/pads 9 and 10: OUT and OUTQ
pad 13: AGC (TZA3023U only)
pin 1/pad 1: DREF
PARAMETER
PARAMETER
8
0.5
0.5
0.5
0.5
0.5
1
15
0.2
2.5
65
40
MIN.
VALUE
160
CC
and GND pads first, the
+6
+1
V
V
V
+2.5
+15
+0.2
+2.5
300
+150
125
+85
CC
CC
CC
MAX.
Product specification
+ 0.5
+ 0.5
+ 0.5
TZA3023
UNIT
V
V
V
V
V
mA
mA
mA
mA
mW
K/W
C
C
C
UNIT