TZA3023T NXP Semiconductors, TZA3023T Datasheet - Page 20

• Manufacturer Part Number: TZA3023T
• Manufacturer: NXP Semiconductors

Specifications of TZA3023T

• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Not Compliant

Philips Semiconductors
Physical characteristics of the bare die
Note
1. For the TZA3023U/G version only.
2002 Sep 05
Gold layer
Glass passivation
Bonding pad dimension
Metallization
Thickness
Size
Backing
Attach temperature
Attach time
SDH/SONET STM4/OC12
transimpedance amplifier
PARAMETER
(1)
2.8 m Au + 3.2 m TiW
2.1 m PSG (PhosphoSilicate Glass) on top of 0.65 m oxynitride
minimum dimension of exposed metallization is 90
1.22 m W/AlCu/TiW
380 m nominal
1.03
silicon; electrically connected to GND potential through substrate contacts
<440 C; recommended die attach is glue
<15 s
1.30 mm (1.34 mm
2
)
20
VALUE
90 m (pad size = 100
Product specification
TZA3023
100 m)