TZA3044TT/C2 NXP Semiconductors, TZA3044TT/C2 Datasheet - Page 22
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TZA3044TT/C2
Manufacturer Part Number
TZA3044TT/C2
Description
Manufacturer
NXP Semiconductors
Datasheet
1.TZA3044TTC2.pdf
(28 pages)
Specifications of TZA3044TT/C2
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
16
Package Type
TSSOP
Lead Free Status / RoHS Status
Not Compliant
Philips Semiconductors
PACKAGE OUTLINES
2002 Jul 19
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SDH/SONET STM4/OC12 and 1.25
Gbits/s Gigabit Ethernet postamplifiers
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT109-1
0.069
max.
1.75
A
16
1
0.010
0.004
Z
0.25
0.10
pin 1 index
A
1
y
0.057
0.049
1.45
1.25
A
2
076E07
IEC
0.25
0.01
A
3
e
0.019
0.014
0.49
0.36
b
p
D
0.0100
0.0075
0.25
0.19
MS-012
JEDEC
c
REFERENCES
10.0
0.39
0.38
D
9.8
0
(1)
0.16
0.15
E
4.0
3.8
(1)
b
scale
p
0.050
EIAJ
2.5
1.27
22
9
8
e
w
0.244
0.228
H
6.2
5.8
c
M
E
5 mm
0.041
A
1.05
2
L
A
1
0.039
0.016
1.0
0.4
L
p
0.028
0.020
H
0.7
0.6
E
Q
E
detail X
TZA3044; TZA3044B
PROJECTION
EUROPEAN
0.25
0.01
L
v
L
p
Q
0.25
0.01
(A )
w
3
A
Product specification
0.004
0.1
y
A
X
v
ISSUE DATE
97-05-22
99-12-27
M
0.028
0.012
Z
0.7
0.3
(1)
A
SOT109-1
8
0
o
o