MT41J64M16LA-187E:B Micron Technology Inc, MT41J64M16LA-187E:B Datasheet - Page 24

• Manufacturer Part Number: MT41J64M16LA-187E:B
• Manufacturer: Micron Technology Inc
• Type: DDR3 SDRAMr

Specifications of MT41J64M16LA-187E:B

• Organization: 64Mx16
• Density: 1Gb
• Address Bus: 16b
• Maximum Clock Rate: 1.066GHz
• Operating Supply Voltage (typ): 1.5V
• Package Type: FBGA
• Operating Temp Range: 0C to 95C
• Operating Supply Voltage (max): 1.575V
• Operating Supply Voltage (min): 1.425V
• Supply Current: 265mA
• Pin Count: 96
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Compliant

Table 5: 96-Ball FBGA – x16 Ball Descriptions (Continued)
PDF: 09005aef826aa906
1Gb_DDR3_SDRAM.pdf – Rev. J 05/10 EN
DQ13, DQ14, DQ15
DQ8, DQ9, DQ10,
DQ0, DQ1, DQ2,
DQ3, DQ4, DQ5,
UDQS, UDQS#
DQ11, DQ12,
LDQS, LDQS#
DQ6, DQ7
Symbol
V
V
UDM
V
V
V
REFDQ
REFCA
V
ZQ
NC
DDQ
SSQ
DD
SS
Reference
Supply
Supply
Supply
Supply
Supply
Supply
Type
Input
I/O
I/O
I/O
I/O
–
Description
Input data mask: UDM is an upper-byte, input mask signal for write data. Upper-
byte input data is masked when UDM is sampled HIGH along with that input data
during a WRITE access. Although the UDM ball is input-only, the UDM loading is
designed to match that of the DQ and DQS balls. UDM is referenced to V
Data input/output: Lower byte of bidirectional data bus for the x16 configuration.
DQ[7:0] are referenced to V
Data input/output: Upper byte of bidirectional data bus for the x16 configuration.
DQ[15:8] are referenced to V
Lower byte data strobe: Output with read data. Edge-aligned with read data.
Input with write data. Center-aligned to write data.
Upper byte data strobe: Output with read data. Edge-aligned with read data.
Input with write data. DQS is center-aligned to write data.
Power supply: 1.5V ±0.075V.
DQ power supply: 1.5V ±0.075V. Isolated on the device for improved noise immunity.
Reference voltage for control, command, and address: V
maintained at all times (including self refresh) for proper device operation.
Reference voltage for data: V
refresh) for proper device operation.
Ground.
DQ ground: Isolated on the device for improved noise immunity.
External reference ball for output drive calibration: This ball is tied to an
external 240Ω resistor (RZQ), which is tied to V
No connect: These balls should be left unconnected (the ball has no connection to
the DRAM or to other balls).
24
REFDQ
REFDQ
REFDQ
.
.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Ball Assignments and Descriptions
must be maintained at all times (excluding self
1Gb: x4, x8, x16 DDR3 SDRAM
SSQ
.
© 2006 Micron Technology, Inc. All rights reserved.
REFCA
must be
REFDQ
.