MT18HTF25672PDY-80EE1 Micron Technology Inc, MT18HTF25672PDY-80EE1 Datasheet - Page 2

• Manufacturer Part Number: MT18HTF25672PDY-80EE1
• Manufacturer: Micron Technology Inc

Specifications of MT18HTF25672PDY-80EE1

• Main Category: DRAM Module
• Sub-category: DDR2 SDRAM
• Module Type: 240RDIMM
• Device Core Size: 72b
• Organization: 256Mx72
• Total Density: 2GByte
• Chip Density: 1Gb
• Access Time (max): 40ps
• Maximum Clock Rate: 800MHz
• Operating Supply Voltage (typ): 1.8V
• Operating Current: 1.773A
• Number Of Elements: 18
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 65C
• Operating Temperature Classification: Commercial
• Pin Count: 240
• Mounting: Socket
• Lead Free Status / RoHS Status: Compliant

Table 2:
Table 3:
Table 4:
Table 5:
PDF: 09005aef80e935cd/Source: 09005aef80e934a6
HTF18C64_128_256x72D.fm - Rev. D 9/06 EN
Refresh count
Row address
Device bank address
Device page size per bank
Device configuration
Column address
Module rank address
MT18HTF25672(P)D(P)Y-80E__
MT18HTF25672(P)D(P)Y-800__
MT18HTF25672(P)D(P)Y-667__
MT18HTF25672(P)D(P)Y-53E__
MT18HTF25672(P)D(P)Y-40E__
MT18HTF12872(P)D(P)Y-80E__
MT18HTF12872(P)D(P)Y-800__
MT18HTF12872(P)D(P)Y-667__
MT18HTF12872(P)D(P)Y-53E__
MT18HTF12872(P)D(P)Y-40E__
MT18HTF6472(P)D(P)Y-667__
MT18HTF6472(P)D(P)Y-53E__
MT18HTF6472(P)D(P)Y-40E__
Part Number
Part Number
Part Number
Addressing
Part Numbers and Timing Parameters – 512MB Modules
Base device: MT47H32M8, 256Mb DDR2 SDRAM
Part Numbers and Timing Parameters – 1GB Modules
Base device: MT47H64M8, 512Mb DDR2 SDRAM
Part Numbers and Timing Parameters – 2GB Modules
Base device: MT47H128M8, 1Gb DDR2 SDRAM
Notes:
1
1
1
1. All part numbers end with a two-place code (not shown), designating component and PCB
revisions. Consult factory for current revision codes. Example: MT18HTF12872(P)DY-667C2.
512MB, 1GB, 2GB (x72, ECC, DR) 240-Pin DDR2 SDRAM RDIMM
Module
Density
Module
Density
Module
Density
512MB
512MB
512MB
2GB
2GB
2GB
2GB
2GB
1GB
1GB
1GB
1GB
1GB
Configuration
Configuration
Configuration
128 Meg x72
128 Meg x72
128 Meg x72
128 Meg x72
128 Meg x72
256 Meg x72
256 Meg x72
256 Meg x72
256 Meg x72
256 Meg x72
64 Meg x72
64 Meg x72
64 Meg x72
256Mb (32 Meg x 8)
4 (BA0, BA1)
8K (A0–A12)
1K (A0–A9)
2 (S0#, S1#)
512MB
2
1KB
8K
Bandwidth
Bandwidth
Bandwidth
Module
Module
Module
6.4 GB/s
6.4 GB/s
5.3 GB/s
4.3 GB/s
3.2 GB/s
Micron Technology, Inc., reserves the right to change products or specifications without notice.
6.4 GB/s
6.4 GB/s
5.3 GB/s
4.3 GB/s
3.2 GB/s
5.3 GB/s
4.3 GB/s
3.2 GB/s
512Mb (64 Meg x 8)
16K (A0–A13)
4 (BA0, BA1)
2 (S0#, S1#)
1K (A0–A9)
Memory Clock/
Memory Clock/
3.75ns/533 MT/s
Memory Clock/
3.75ns/533 MT/s
1GB
3.75ns/533 MT/s
1KB
2.5ns/800 MT/s
2.5ns/800 MT/s
3.0ns/667MT/s
5.0ns/400MT/s
2.5ns/800 MT/s
3.0ns/667MT/s
5.0ns/400MT/s
2.5ns/800MT/s
3.0ns/667MT/s
5.0ns/400MT/s
8K
Data Rate
Data Rate
Data Rate
©2006 Micron Technology, Inc. All rights reserved.
1Gb (128 Meg x 8)
8 (BA0, BA1, BA2)
16K (A0–A13)
(CL -
(CL -
(CL -
2 (S0#, S1#)
1K (A0–A9)
Latency
2GB
Latency
Latency
1KB
8K
t
t
t
5-5-5
4-4-4
3-3-3
RCD -
5-5-5
6-6-6
5-5-5
4-4-4
3-3-3
5-5-5
6-6-6
5-5-5
4-4-4
3-3-3
Features
RCD -
RCD -
t
t
t
RP)
RP)
RP)