MT18HTF25672PDY-80EE1 Micron Technology Inc, MT18HTF25672PDY-80EE1 Datasheet - Page 8

• Manufacturer Part Number: MT18HTF25672PDY-80EE1
• Manufacturer: Micron Technology Inc

Specifications of MT18HTF25672PDY-80EE1

• Main Category: DRAM Module
• Sub-category: DDR2 SDRAM
• Module Type: 240RDIMM
• Device Core Size: 72b
• Organization: 256Mx72
• Total Density: 2GByte
• Chip Density: 1Gb
• Access Time (max): 40ps
• Maximum Clock Rate: 800MHz
• Operating Supply Voltage (typ): 1.8V
• Operating Current: 1.773A
• Number Of Elements: 18
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 65C
• Operating Temperature Classification: Commercial
• Pin Count: 240
• Mounting: Socket
• Lead Free Status / RoHS Status: Compliant

I
Table 9:
PDF: 09005aef80e935cd/Source: 09005aef80e934a6
HTF18C64_128_256x72D.fm - Rev. D 9/06 EN
Parameter/Condition
Operating one bank active-precharge current:
(I
commands; Address bus inputs are switching; Data bus inputs are switching
Operating one bank active-read-precharge current: I
CL = CL (I
t
bus inputs are switching; Data pattern is same as I
Precharge power-down current: All device banks idle;
is LOW; Other control and address bus inputs are stable; Data bus inputs are
floating
Precharge quiet standby current: All device banks idle;
CKE is HIGH, S# is HIGH; Other control and address bus inputs are stable; Data
bus inputs are floating
Precharge standby current: All device banks idle;
HIGH, S# is HIGH; Other control and address bus inputs are switching; Data
bus inputs are switching
Active power-down current: All device banks open;
t
inputs are stable; Data bus inputs are floating
Active standby current: All device banks open;
MAX (I
Other control and address bus inputs are switching; Data bus inputs are
switching
Operating burst write current: All device banks open; Continuous burst
writes; BL = 4, CL = CL (I
t
inputs are switching; Data bus inputs are switching
Operating burst read current: All device banks open; Continuous burst
reads, I
MAX (I
Address bus inputs are switching; Data bus inputs are switching
Burst refresh current:
interval; CKE is HIGH, S# is HIGH between valid commands; Other control and
address bus inputs are switching; Data bus inputs are switching
Self refresh current: CK and CK# at 0V; CKE ≤ 0.2V; Other control and
address bus inputs are floating; Data bus inputs are floating
Operating bank interleave read current: All device banks interleaving
reads, I
(I
HIGH between valid commands; Address bus inputs are stable during
DESELECTs; Data bus inputs are switching
DD
RCD =
CK =
RP =
DD
DD
),
),
Specifications
t
t
t
t
RP (I
RAS =
RC =
CK (I
DD
DD
OUT
OUT
t
RCD (I
DD
),
),
DD
= 0mA; BL = 4, CL = CL (I
DD
t
= 0mA; BL = 4, CL = CL (I
t
t
), AL = 0;
RP =
RP =
RC (I
t
); CKE is HIGH, S# is HIGH between valid commands; Address bus
RAS MIN (I
DDR2 I
Values shown for MT47H32M8 DDR2 SDRAM only and are computed from values specified in the 256Mb
(32 Meg x 8) component data sheet
); CKE is LOW; Other control and address bus
DD
); CKE is HIGH, S# is HIGH between valid commands; Address
DD
t
t
RP (I
RP (I
Notes:
),
t
t
CK =
RRD =
DD
DD
DD
DD
DD
t
); CKE is HIGH, S# is HIGH between valid commands;
); CKE is HIGH, S# is HIGH between valid commands;
CK =
Specifications and Conditions – 512MB
), AL = 0;
); CKE is HIGH, S# is HIGH between valid
t
CK (I
1. a = Value calculated as one module rank in this operating condition; all other module ranks
2. b = Value calculated reflects all module ranks in this operating condition.
t
RRD (I
t
CK (I
in I
DD
DD
DD
),
512MB, 1GB, 2GB (x72, ECC, DR) 240-Pin DDR2 SDRAM RDIMM
DD
DD
DD
t
CK =
t
2P (CKE LOW) mode.
), AL =
RC =
); REFRESH command at every
),
), AL = 0;
t
RCD =
t
CK (I
t
RC (I
t
RCD (I
DD
t
t
RCD (I
DD
CK =
),
t
DD
),
CK =
DD
t
t
RAS =
t
CK =
t
4W
RAS =
) -1 x
CK =
t
DD
CK (I
t
CK (I
); CKE is HIGH, S# is
t
t
OUT
CK (I
CK =
t
t
t
DD
CK (I
t
CK (I
RAS MAX (I
t
CK =
RAS MIN (I
8
Fast PDN exit
MR[12] = 0
Slow PDN exit
MR[12] = 1
DD
),
= 0mA; BL = 4,
DD
t
t
),
DD
DD
RAS =
CK (I
t
t
),
CK (I
RAS =
);
); CKE is
t
t
RC =
t
RFC (I
CK =
DD
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DD
t
DD
DD
RAS
); CKE
t
);
t
RAS
),
),
t
RC
DD
CK
)
Symbol
I
I
I
I
I
I
I
DD
DD
DD
DD
DD
DD
DD
I
I
I
I
I
DD
DD
DD
DD
DD
4W
2Q
2N
3N
2P
3P
4R
0
1
5
6
7
b
b
a
a
a
b
b
a
b
b
b
a
1,755
1,665
3,240
2,295
-667
855
945
720
720
540
108
900
90
90
©2006 Micron Technology, Inc. All rights reserved.
1,485
1,395
3,060
2,205
-53E
765
855
630
630
450
108
720
90
90
Capacitance
1,170
1,080
2,970
2,115
-40E
720
810
450
540
360
108
540
90
90
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA