MT18LSDT3272AG-133G3 Micron Technology Inc, MT18LSDT3272AG-133G3 Datasheet - Page 11

• Manufacturer Part Number: MT18LSDT3272AG-133G3
• Manufacturer: Micron Technology Inc

Specifications of MT18LSDT3272AG-133G3

• Main Category: DRAM Module
• Sub-category: SDRAM
• Module Type: 168UDIMM
• Device Core Size: 72b
• Organization: 32Mx72
• Total Density: 256MByte
• Chip Density: 128Mb
• Access Time (max): 6/5.4ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 3.3V
• Operating Current: 1.368A
• Number Of Elements: 18
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Operating Temp Range: 0C to 65C
• Operating Temperature Classification: Commercial
• Pin Count: 168
• Mounting: Socket
• Lead Free Status / RoHS Status: Not Compliant

because unknown operation or incompatibility with
future versions may result.
Write Burst Mode
M2 applies to both READ and WRITE bursts; when M9
= 1, the programmed burst length applies to READ
bursts, but write accesses are single-location (non-
burst) accesses.
09005aef807b3709
SD9_18C16_32x72AG.fm - Rev. E 6/04 EN
Test modes and reserved states should not be used
When M9 = 0, the burst length programmed via M0-
128MB (x72, ECC, SR), 256MB (x72, ECC, DR)
11
Table 8:
SPEED
-13E
-133
-10E
Micron Technology, Inc., reserves the right to change products or specifications without notice.
CAS LATENCY = 2
168-PIN SDRAM UDIMM
CAS Latency Table
≤ 133
≤ 100
≤ 100
CLOCK FREQUENCY (MHz)
ALLOWABLE OPERATING
CAS LATENCY = 3
©2004 Micron Technology, Inc.
≤ 133
≤ 143
N/A