MT18LSDT3272AG-133G3 Micron Technology Inc, MT18LSDT3272AG-133G3 Datasheet - Page 15

• Manufacturer Part Number: MT18LSDT3272AG-133G3
• Manufacturer: Micron Technology Inc

Specifications of MT18LSDT3272AG-133G3

• Main Category: DRAM Module
• Sub-category: SDRAM
• Module Type: 168UDIMM
• Device Core Size: 72b
• Organization: 32Mx72
• Total Density: 256MByte
• Chip Density: 128Mb
• Access Time (max): 6/5.4ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 3.3V
• Operating Current: 1.368A
• Number Of Elements: 18
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Operating Temp Range: 0C to 65C
• Operating Temperature Classification: Commercial
• Pin Count: 168
• Mounting: Socket
• Lead Free Status / RoHS Status: Not Compliant

Table 14: Capacitance – 128MB
Note 2; notes appear on page 18
Table 15: Capacitance – 256MB
Note 2; notes appear on page 18
09005aef807b3709
SD9_18C16_32x72AG.fm - Rev. E 6/04 EN
PARAMETER
Input Capacitance: Address and Command
Input Capacitance: CK0
Input Capacitance: CK2
Input Capacitance: S0#
Input Capacitance: S2#
Input Capacitance: CKE
Input Capacitance: DQMB0, 2–4, 6, 7
Input Capacitance: DQMB1
Input/Output Capacitance: DQ, CB
PARAMETER
Input Capacitance: Address and Command
Input Capacitance: CK0
Input Capacitance: CK2
Input Capacitance: S0#
Input Capacitance: S2#
Input Capacitance: CKE
Input Capacitance: DQMB0, 2–4, 6, 7
Input Capacitance: DQMB1
Input/Output Capacitance: DQ, CB
.
128MB (x72, ECC, SR), 256MB (x72, ECC, DR)
15
.
Micron Technology, Inc., reserves the right to change products or specifications without notice.
SYMBOL
SYMBOL
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
IO
IO
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
1
2
2
3
3
4
5
6
1
2
2
3
3
4
5
6
168-PIN SDRAM UDIMM
MIN
MIN
22.5
12.5
13.3
12.5
22.5
12.5
13.3
12.5
22.5
2.5
7.5
10
45
10
5
4
5
8
MAX
MAX
34.2
17.5
17.3
15.2
34.2
68.4
17.5
17.3
15.2
34.2
11.4
3.8
7.6
7.6
19
19
12
6
©2004 Micron Technology, Inc.
UNITS
UNITS
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF