MT18LSDT3272AG-133G3 Micron Technology Inc, MT18LSDT3272AG-133G3 Datasheet - Page 2

• Manufacturer Part Number: MT18LSDT3272AG-133G3
• Manufacturer: Micron Technology Inc

Specifications of MT18LSDT3272AG-133G3

• Main Category: DRAM Module
• Sub-category: SDRAM
• Module Type: 168UDIMM
• Device Core Size: 72b
• Organization: 32Mx72
• Total Density: 256MByte
• Chip Density: 128Mb
• Access Time (max): 6/5.4ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 3.3V
• Operating Current: 1.368A
• Number Of Elements: 18
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Operating Temp Range: 0C to 65C
• Operating Temperature Classification: Commercial
• Pin Count: 168
• Mounting: Socket
• Lead Free Status / RoHS Status: Not Compliant

Table 3:
NOTE:
09005aef807b3709
SD9_18C16_32x72AG.fm - Rev. E 6/04 EN
PART NUMBER
MT9LSDT1672AG-13E_
MT9LSDT1672AY-13E_
MT9LSDT1672AG-133_
MT9LSDT1672AY-133_
MT9LSDT1672AG-10E_
MT9LSDT1672AY-10E_
MT18LSDT3272AG-13E_
MT18LSDT3272AY-13E_
MT18LSDT3272(L)AG-133_
MT18LSDT3272(L)AY-133_
MT18LSDT3272AG-10E_
MT18LSDT3272AY-10E_
Designators for component and PCB revision are the last two characters of each part number Consult factory for current
revision codes. Example: MT9LSDT1672G-133B1.
Part Numbers
MODULE DENSITY
128MB (x72, ECC, SR), 256MB (x72, ECC, DR)
128MB
128MB
128MB
128MB
128MB
128MB
256MB
256MB
256MB
256MB
256MB
256MB
2
CONFIGURATION
Micron Technology, Inc., reserves the right to change products or specifications without notice.
16 Meg x 72
16 Meg x 72
16 Meg x 72
16 Meg x 72
16 Meg x 72
16 Meg x 72
32 Meg x 72
32 Meg x 72
32 Meg x 72
32 Meg x 72
32 Meg x 72
32 Meg x 72
168-PIN SDRAM UDIMM
BUS SPEED
SYSTEM
133 MHz
133 MHz
133 MHz
133 MHz
100 MHz
100 MHz
133 MHz
133 MHz
133 MHz
133 MHz
100 MHz
100 MHz
©2004 Micron Technology, Inc.