HFCT-5961TG Avago Technologies US Inc., HFCT-5961TG Datasheet - Page 9

• Manufacturer Part Number: HFCT-5961TG
• Manufacturer: Avago Technologies US Inc.

Specifications of HFCT-5961TG

• Optical Fiber Type: TX/RX
• Data Transfer Rate: 155Mbps
• Optical Rise Time: 2ns
• Optical Fall Time: 2ns
• Operating Temperature Classification: Commercial
• Peak Wavelength: 1360nm
• Package Type: DIP With Connector
• Operating Supply Voltage (min): 3.1V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.5V
• Output Current: 50mA
• Operating Temp Range: 0C to 70C
• Mounting: Snap Fit To Panel
• Pin Count: 10
• Lead Free Status / RoHS Status: Compliant

Signal Detect
The Signal Detect circuit provides a de-asserted output
signal when the optical link is broken (or when the re-
mote transmitter is OFF). The Signal Detect threshold is
set to transition from a high to low state between the
minimum receiver input optical power and -45 dBm avg.
input optical power indicating a definite optical fault
(e.g. unplugged connector for the receiver or transmit-
ter, broken fiber, or failed far-end transmitter or data
source). The Signal Detect does not detect receiver data
error or error-rate. Data errors can be determined by sig-
nal processing offered by upstream PHY ICs.
Electromagnetic Interference (EMI)
One of a circuit board designer’s foremost concerns is
the control of electromagnetic emissions from electron-
ic equipment. Success in controlling generated Electro-
magnetic Interference (EMI) enables the designer to pass
a governmental agency’s EMI regulatory standard and
more importantly, it reduces the possibility of interfer-
ence to neighboring equipment. Avago Technologies
has designed the HFCT-5961TL/TG/NL/NG/ATL/ATG to
9
Figure 7. Recommended Board Layout Hole Pattern
(0.525)
(0.299)
DIMENSIONS IN MILLIMETERS (INCHES)
NOTES:
1. THIS FIGURE DESCRIBES THE RECOMMENDED CIRCUIT BOARD LAYOUT FOR THE SFF TRANSCEIVER.
2. THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFFS. NO METAL TRACES OR
3. 2 x 5 TRANSCEIVER MODULE REQUIRES 16 PCB HOLES (10 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE
4. THE MOUNTING STUDS SHOULD BE SOLDERED TO CHASSIS GROUND FOR MECHANICAL INTEGRITY AND TO
5. HOLES FOR HOUSING LEADS MUST BE TIED TO SIGNAL GROUND.
13.34
7.59
GROUND CONNECTION IN KEEP-OUT AREAS.
GROUNDING TABS).
PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND.
ENSURE FOOTPRINT COMPATIBILITY WITH OTHER SFF TRANSCEIVERS.
2 x Ø 2.29 MAX.
(0.118)
3
(0.09)
(0.055 ±0.004)
2 x Ø 1.4 ±0.1
(0.236)
(0.118)
6
3
(0.28)
7.11
(0.18)
4.57
(0.700)
(0.055 ±0.004)
2 x Ø 1.4 ±0.1
17.8
4 x 1.78
(0.07)
(0.121)
3.08
(0.079)
(0.14)
3.56
2
10.16
(0.4)
(0.378)
provide excellent EMI performance. The EMI perfor-
mance of a chassis is dependent on physical design and
features which help improve EMI suppression. Avago
Technologies encourages using standard RF suppres-
sion practices and avoiding poorly EMI-sealed enclo-
sures.
Avago Technologies’ OC-3 LC transceivers (HFCT-
5961TL/TG/NL/NG/ATL/ATG) have nose shields which
provide a convenient chassis connection to the nose
of the transceiver. This nose shield improves system
EMI performance by effectively closing off the LC aper-
ture. Localized shielding is also improved by tying the
four metal housing package grounding tabs to signal
ground on the PCB. Though not obvious by inspec-
tion, the nose shield and metal housing are electrically
separated for customers who do not wish to directly tie
chassis and signal grounds together. The recommended
transceiver position, PCB layout and panel opening for
these devices are the same, making them mechanically
drop-in compatible. Figure 8 shows the recommended
positioning of the transceivers with respect to the PCB
and faceplate.
9.59
10 x Ø 0.81 ±0.1
(0.032 ±0.004)
2 x Ø 2.29
(0.09)
(0.079)
2
(0.055 ±0.004)
4 x Ø 1.4 ±0.1