UPD720122GC-9EU-A Renesas Electronics America, UPD720122GC-9EU-A Datasheet - Page 82

• Manufacturer Part Number: UPD720122GC-9EU-A
• Manufacturer: Renesas Electronics America

Specifications of UPD720122GC-9EU-A

• Lead Free Status / RoHS Status: Supplier Unconfirmed

Note
Note
•
•
80
Infrared ray reflow
Infrared ray reflow
µ
µ
PD720122F1-DN2: 109-pin plastic FBGA (11 × 11)
PD720122F1-DN2-A: 109-pin plastic FBGA (11 × 11)
Soldering Method
Soldering Method
The Maximum number of days during which the product can be stored at a temperature of 25°C and a relative
humidity of 65% or less after dry-pack package is opened.
The Maximum number of days during which the product can be stored at a temperature of 25°C and a relative
humidity of 65% or less after dry-pack package is opened.
Table 4-1. Recommended Soldering Conditions of Surface-Mount Type (2/2)
Peak package’s surface temperature: 235° C, Reflow time: 30 seconds or less
(210 °C or higher), Maximum allowable number of reflow processes: 3,
Exposure limit
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be baked
before unpacking.
Peak package’s surface temperature: 250° C, Reflow time: 60 seconds or less
(220 °C or higher), Maximum allowable number of reflow processes: 2,
Exposure limit
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be baked
before unpacking.
Note
Note
: 7 days (10 hours pre-backing is required at 125C° afterwards).
: 3 days (10 hours pre-backing is required at 125C° afterwards),
Data Sheet S16685EJ3V0DS
Soldering Conditions
Soldering Conditions
µ
PD720122
IR35-107-3
IR50-103-2
Symbol
Symbol