LH75411 NXP Semiconductors, LH75411 Datasheet - Page 55

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LH75411

Manufacturer Part Number
LH75411
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LH75411

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System-on-Chip
SUGGESTED EXTERNAL COMPONENTS
nents for the 32.768 kHz crystal circuit to be used with
the NXP LH75401/LH75411. The NAND gate repre-
sents the logic inside the SoC. See the chart for crys-
tal specifics.
Product data sheet
Figure 21 shows the suggested external compo-
NOTES:
1. Y1 is a parallel-resonant type crystal. (See table)
2. The nominal values for C1 and C2 shown are for
3. The values for C1 and C2 are dependent upon
4. R1 must be in the circuit.
5. Ground connections should be short and return
6. Tolerance for R1, C1, C2 is ≤ 5%.
a crystal specified at 12.5 pF load capacitance (CL).
the cystal's specified load capacitance and PCB
stray capacitance.
to the ground plane which is connected to the
processor's core ground pins.
Figure 21. Suggested External Components, 32.768 kHz Oscillator
INTERNAL TO THE
LH75400, LH75401,
LH75410, LH75411
EXTERNAL TO THE
LH75400, LH75401,
LH75410, LH75411
Rev. 02 — 19 March 2009
NXP Semiconductors
ENABLE
XTAL32IN
RECOMMENDED CRYSTAL SPECIFICATIONS
PARAMETER
32.768 kHz Crystal
Tolerance
Aging
Load Capacitance
ESR (MAX.)
Drive Level
Recommended Part
nents for the 14.7456 MHz crystal circuit to be used
with the NXP LH75401/LH75411. The NAND gate rep-
resents the logic inside the SoC. See the chart for crys-
tal specifics.
Figure 22 shows the suggested external compo-
C1
15 pF
GND
32.768 kHz
18 MΩ
Y1
R1
DESCRIPTION
Parallel Mode
±30 ppm
±3 ppm
12.5 pF
50 kΩ
1.0 µW (MAX.)
MTRON SX1555 or equivalent
XTAL32OUT
C2
18 pF
GND
LH75401/LH75411
LH754xx-101
55

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