MC9S08AW60CFGE Freescale, MC9S08AW60CFGE Datasheet - Page 17

• Manufacturer Part Number: MC9S08AW60CFGE
• Manufacturer: Freescale

Specifications of MC9S08AW60CFGE

• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 2KB
• # I/os (max): 34
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: LQFP
• Program Memory Type: Flash
• Program Memory Size: 60KB
• Lead Free Status / RoHS Status: Compliant

Section Number
14.6 Initialization Information ..............................................................................................................263
14.7 Application Information ................................................................................................................265
15.1 Introduction ...................................................................................................................................271
15.2 Background Debug Controller (BDC) ..........................................................................................272
15.3 On-Chip Debug System (DBG) ....................................................................................................281
15.4 Register Definition ........................................................................................................................285
A.1 Introduction ....................................................................................................................................293
A.2 Parameter Classification.................................................................................................................293
A.3 Absolute Maximum Ratings...........................................................................................................293
A.4 Thermal Characteristics..................................................................................................................294
A.5 ESD Protection and Latch-Up Immunity .......................................................................................296
A.6 DC Characteristics..........................................................................................................................297
A.7 Supply Current Characteristics.......................................................................................................301
A.8 ADC Characteristics.......................................................................................................................304
A.9 Internal Clock Generation Module Characteristics ........................................................................307
A.10 AC Characteristics..........................................................................................................................311
Freescale Semiconductor
14.5.7 MCU Stop3 Mode Operation ..........................................................................................262
14.5.8 MCU Stop1 and Stop2 Mode Operation .........................................................................263
14.6.1 ADC Module Initialization Example .............................................................................263
14.7.1 External Pins and Routing ..............................................................................................265
14.7.2 Sources of Error ..............................................................................................................267
15.1.1 Features ...........................................................................................................................272
15.2.1 BKGD Pin Description ...................................................................................................273
15.2.2 Communication Details ..................................................................................................274
15.2.3 BDC Commands .............................................................................................................278
15.2.4 BDC Hardware Breakpoint .............................................................................................280
15.3.1 Comparators A and B .....................................................................................................281
15.3.2 Bus Capture Information and FIFO Operation ...............................................................281
15.3.3 Change-of-Flow Information ..........................................................................................282
15.3.4 Tag vs. Force Breakpoints and Triggers .........................................................................282
15.3.5 Trigger Modes .................................................................................................................283
15.3.6 Hardware Breakpoints ....................................................................................................285
15.4.1 BDC Registers and Control Bits .....................................................................................285
15.4.2 System Background Debug Force Reset Register (SBDFR) ..........................................287
15.4.3 DBG Registers and Control Bits .....................................................................................288
A.9.1 ICG Frequency Specifications .........................................................................................308
Electrical Characteristics and Timing Specifications
MC9S08AC16 Series Data Sheet, Rev. 8
Development Support
Appendix A
Chapter 15
Title
Page
17